Wafer inspection microscopeIt is an optical instrument used for surface and internal structure inspection of semiconductor wafers, which can help technicians quickly detect defects on the wafer and ensure product quality.

Main functions:

Defect detection: It can quickly detect defects such as scratches, contamination, holes, cracks, etc. on the surface of the wafer, as well as abnormalities in the internal structure.

Size measurement: With the equipped measurement software, accurate measurements of line width, graphic size, spacing, etc. on the wafer can be taken.

Image analysis: It can process and analyze the collected images, such as contrast adjustment, edge detection, defect classification, etc., to provide data support for quality control and process improvement.

　　Wafer inspection microscopeBy combining optical systems with imaging technology, precise observation of the surface and internal microstructure of wafers can be achieved. The core principle is:

Optical imaging system

Lighting method: Supports transmissive (for transparent/semi transparent wafers) and reflective (for opaque wafers) lighting, with light source types including halogen lamps, LED lamps, etc. Among them, LED lamps have become mainstream due to their long lifespan and low heat generation.

Objective lens and eyepiece: The objective lens is a key optical component that provides multiple magnifications such as 5X, 10X, 20X, and 40X, while the eyepiece further magnifies the image.

Spotlight: By adjusting the numerical aperture, the light source is focused onto the surface of the wafer, enhancing illumination brightness and improving observation clarity.

Multi mode observation technique

Bright field/dark field observation: Bright field detection identifies larger defects such as scratches and particles through changes in reflected light intensity; Dark field detection uses scattered light to analyze sub 100 nanometer level small defects.

Differential interference (DIC): enhances image contrast through optical path difference, clearly presenting the three-dimensional structure of crystal defects.

Fluorescence and polarization observation: optional fluorescence module can be used to detect photoluminescence characteristics, and polarization module can be used to analyze crystal orientation to meet the requirements of * - level program.