What aspects can be considered when purchasing a fully automatic wafer contact angle measuring instrument?

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Date: 2025-07-02Read: 0

The measurement of contact angle on wafers is crucial for evaluating the wettability and surface properties of these materials, which are widely used in electronic manufacturing. By evaluating the angle of contact between the droplet and the chip surface, researchers can gain a deeper understanding of the surface energy and adhesion properties of silicon. These pieces of information are crucial for optimizing processes such as coating, photolithography, and bonding in semiconductor manufacturing. Understanding the contact angle helps ensure the expected interactions between the chip and various materials used in the production process, thereby improving the performance and reliability of electronic devices.Fully automatic wafer contact angle measuring instrumentBy testing the size of the contact angle formed by droplets on the surface of the wafer sample, the cleanliness of its surface can be detected and the process effect of surface treatment can be evaluated.

In the process of purchasingFully automatic wafer contact angle measuring instrumentThe following factors can be considered:

1. Core parameters:

Angle resolution: Priority should be given to models within ± 0.1 °, and high-precision requirements can be selected within ± 0.01 °.

Repetitive error: The standard deviation of multiple measurements of the same sample should be less than ± 0.5 °.

Contact angle range: It needs to cover 0 °~180 °.

2. Imaging system:

Equipped with high-speed industrial cameras (such as over 5 million pixels) and telecentric optical lenses to reduce distortion.

Frame rate ≥ 1000fps to support dynamic process capture.

3. Functional scalability:

Light source system: Optional adjustable brightness/color temperature light source and polarized light mode to eliminate reflection interference.

Sample stage: supports electric lifting (stroke ≥ 50mm), tilting (± 60 °), and constant temperature heating.

Automation module: The electric XYZ three-axis displacement table enables continuous measurement at multiple positions.

4. Software functions:

Support algorithms such as circle fitting, ellipse fitting, and Young Laplace equation fitting.

Integrated surface free energy calculation module.

Provide automatic batch processing, CSV/Excel data export, and image archiving functions.

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