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Grayscale lithography optical interconnect nanomanufacturing solution, equipment manufacturer Nano 3D Nanoscribe solves it for you!
Date: 2025-11-03Read: 0
Grayscale lithography for optical interconnect nanomanufacturing refers to the use of grayscale lithography technology to manufacture various key three-dimensional micro nano optical structures required for optical interconnect in one go with high precision.
The solution of grayscale photolithography for optical interconnect nanomanufacturing has become an important way to solve the problem of optical interconnect nanomanufacturing due to its advantages of high precision and high efficiency. The related solutions of nano Nuo 3D have strong representativeness. The following is a specific introduction:
Core technology: Nano 3D grayscale lithography optical interconnect nanomanufacturing solution. The core technology is two-photon grayscale lithography technology (2GL) ®)。 This technology combines the excellent performance of grayscale lithography with the uniqueness and flexibility of two-photon polymerization. Through the deep collaboration of high-frequency laser galvanometer and 100MHz dynamic voxel adjustment technology, it achieves maskless direct writing 3D printing, which can control voxel size and energy in real time, and can form three-dimensional micro nano structures in one go without the need for multi-layer slicing.
Equipment support: Its QuantumX series is the first dual photon grayscale lithography laser direct writing system in China. For example, the QuantumXalign system has a surface roughness of ≤ 10nm and a feature size control of up to 100nm. It can directly print free-form micro optical components on fiber end faces and photonic chips. It can also achieve sub micron level automatic alignment through 3D automatic fiber core detection and substrate topology mapping, reducing coupling loss to below 1dB. The QuantumXlitho system can handle different types of substrates, such as glass slides or silicon chips up to 6 inches in size, designed for rapid prototyping, small batch production, and efficient manufacturing of master plates in replication processes.
Process advantages: Firstly, ultra-high precision coupling structure processing, with processing resolution as low as 100 nanometers or less, optical grade surface roughness (Ra<5nm), can directly print micro lens arrays, gradient refractive index lenses and other structures required for fiber chip and chip chip coupling, and can control the coupling loss of photonic devices within 1.5dB. The second is multi material compatibility and heterogeneous integration, supporting various commonly used substrates for photon packaging such as photoresist, glass, silicon-based materials, and biocompatible materials, which can achieve integrated printing of "micro optical structures+conductive interconnect channels" on the same chip. The third is cross scale structural manufacturing, which can achieve both nanoscale fine features, such as photonic crystal aperture<200nm, and millimeter scale overall structures, such as microfluidic optical chips.
Application scenario: This solution covers the entire process of photon packaging from research and development to mass production. Targeting universities and research institutions, the prototype preparation of new photon coupling structures can be completed within 1-2 days, assisting in the research and development of cutting-edge technologies such as metasurfaces and quantum photonic devices; For the industrial end, small batch production of optical communication micro lens arrays, MEMS optical switches, and other devices can be achieved through a 6-inch wafer level processing platform and automated process design, without the need to change masks to switch product models. The production efficiency is increased by more than 30% compared to traditional processes.