Maskless lithography equipmentIt is a process testing instrument that directly projects circuit patterns onto photosensitive materials through a high-precision optical system, eliminating the mask making process required by traditional photolithography. This device can be divided into optical and charged particle categories, including laser direct writing, electron beam direct writing and other technical types. In semiconductor manufacturing, its significant advantages include improving lithography efficiency, reducing production costs, and shortening research and development cycles. It is widely used in the fields of biochips, microelectromechanical systems, and advanced packaging.
The maskless lithography machine is based on spatial light modulator scanning technology or charged particle beam direct writing method, which directly converts the digital layout into physical patterns on the photoresist, achieving maskless rapid prototyping. Its core technical indicators include minimum line width, automatic resolution switching, and grayscale lithography function.
Application field
Microfluidic chip development: suitable for research in fields such as microfluidics and microelectronics.
Power chip lithography: supports multi layout experiments for carbon nanotube integrated circuits.
3D optical components: Gray scale lithography technology enables three-dimensional structure processing.
The core functions of the Magic Nano UV Smart Maskless Lithography Equipment include:
High precision machining: Using digital micromirror (DMD) technology, achieving a line width accuracy of 300nm, minimal splicing error, and smooth structural edges.
Efficient direct writing speed: capable of processing 300mm ² per minute, suitable for fast modeling and small batch production.
Fully automatic control: Integrated design, easy operation, supports 12 inch substrates, suitable for fields such as microfluidics and semiconductors.
Industrial grade application: Combining self-developed algorithms with high-performance hardware, it has high alignment and etching accuracy, meeting the needs of large-scale production.