Chip interconnect 3D laser direct writing equipmentIt is a precision machining system that does not require masks and is programmable. It achieves three-dimensional structure manufacturing at the micrometer to nanometer scale by directly scanning and exposing materials such as photoresist with a focused laser beam.
Technical characteristics:
High precision machining: It can achieve three-dimensional manufacturing with nanometer level precision, meeting the high precision requirements of scenarios such as chip interconnection.
Maskless processing: Directly processing based on digital models, eliminating the steps and costs of making masks in traditional photolithography.
3D processing capability: capable of constructing 3D micro nano structures point by point, line by line, or layer by layer, suitable for manufacturing complex devices such as microfluidic devices and photonic crystals.
Advantages of 3D laser direct writing technology:
1. True 3D machining capability
Breaking through the planar limitations of traditional photolithography, complex three-dimensional structures can be directly constructed in the depth direction (such as 1mm depth) to achieve three-dimensional integration of waveguide arrays, photonic chips, and other materials.
2. Flexible manufacturing without masks
Digitized control of laser exposure position and intensity eliminates the need for mask making, significantly reducing research and development costs and accelerating process iteration, making it particularly suitable for small batch and diverse chip interconnection scenarios.
3. Nano level high precision
By focusing femtosecond laser pulses and utilizing nonlinear optical effects, sub micron level processing (such as 5-30 μ m waveguide diameter) is achieved to meet the micro nano precision requirements for chip interconnection.
4. Material universality
Suitable for various material systems such as silicon-based, lithium niobate, and polymers, and can achieve continuous adjustability of refractive index, loss, and other physical properties through parameter control.