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Application and operation specifications of glue baking machine
Date: 2025-06-25Read: 2
  Baking machineIt is a high-performance laboratory equipment designed for accurate temperature control, timing, and high thermal uniformity. It can achieve timed temperature control and glue baking operations. It is mainly used for surface coating and film drying and curing of semiconductor silicon wafers, glass slides, chips, substrates, ITO conductive glass and other processes.
  Baking machineApplication areas:
1. Semiconductor manufacturing: used for key processes such as pre baking and film hardening, ensuring chip manufacturing accuracy through accurate temperature control. Its uniform heating characteristics can avoid the problem of film delamination caused by traditional ovens and improve the yield rate.
2. Nanofilm preparation: Suitable for drying and curing thin films coated on surfaces of semiconductor silicon wafers, glass slides, ITO conductive glass, etc. The problem of bubbles in thick film resin curing is solved by heating from the inside out.
3. In the field of industrial bonding, materials such as resin, rubber, and plastic can be heated to the desired temperature and maintained at a constant level to achieve efficient curing. Compared to traditional methods, it can save curing time and energy consumption, improve adhesive strength and production efficiency.
Operating standards:
1. Equipment inspection: Before use, it is necessary to confirm that the heating system, temperature control system, transmission device, and other components are normal, and to clean the work area of debris and flammable materials.
2. Parameter setting: Reasonably set parameters such as temperature, time, and speed according to process requirements. It is strictly prohibited to touch heating components during operation.
3. Process monitoring: Pay close attention to the operating parameters and abnormal sounds of the equipment. After baking the glue, turn off the heating system first, and clean the residual glue stains after cooling.
4. Maintenance: Regularly inspect key components such as heating parts and temperature sensors, and promptly repair or replace faulty parts.