1、 The core demand of the semiconductor industry for vacuum valves

The semiconductor manufacturing process requires超高真空（UHV）High cleanliness, no particle pollutionConducted in the environment, the vacuum valve serves as a component of the vacuum system “Switches and regulators”To meet the three core requirements:①Good sealing performance (leakage rate)≤10⁻ ¹² Pa・m³/s）To prevent impurities such as air and water vapor from entering;②Material compatibility (no metal pollution, low gas release rate), suitable for sensitive materials such as silicon wafers and photoresist;③Fast response speed (millisecond level switch), long lifespan (over a million cycles), matching the high production capacity requirements of semiconductor production lines.

2、 Key application scenarios and valve types

1. Core process steps in wafer manufacturing

⑴photolithography processThe vacuum chamber of the lithography machine needs to be maintained10⁻⁶~10⁻⁹ PaUltra high vacuum, usingElectromagnetic driven angle valveorMagnetic fluid sealed gate valveTo achieve vacuum isolation between the chamber, lithography light source, and mask stage, while ensuring no particle detachment (cleanliness) when the valve is openedClass 1Grade). In addition, the valve needs to have precise flow regulation function, combined with a vacuum pumping system to stabilize the chamber pressure and avoid distortion of the lithography pattern.

⑵Etching process (dry etching)The plasma etching chamber needs to be controlled by a vacuum valve to control the reaction gas (such as...)CF₄TheO₂）Introduction and discharge, commonly usedPneumatic diaphragm valveorElectric Ball ValveThis type of valve needs to be resistant to plasma corrosion (using ceramic or Hastelloy sealing surfaces), and the opening and closing actions should be free of oil pollution, preventing impurities from reacting with reaction gases and oil stains, which may affect etching accuracy.

⑶Thin film deposition（PVD/CVD）Physical vapor deposition（PVD）Sputtering chamber, chemical vapor deposition（CVD）The reaction chamber requiresVacuum plug valveorbutterfly valveImplement chamber isolation and vacuum switching. Valves need to have rapid vacuum pumping adaptability (flow conductivity)≥1000 L/s）At the same time, the material needs to have low air release (such as316LStainless steel polishing treatment is used to avoid the gas released by itself affecting the purity of the film.

2. Vacuum transmission system（VTS）

The transfer of semiconductor wafers between various process equipment requires the use of vacuum transfer chambers（Load Lock）Implementation, the vacuum valve is responsible for this“Isolate the atmosphere from vacuum”Key role:①adoptQuick vacuum baffle valve, achieveLoad LockRapid vacuuming of the chamber (from atmospheric pressure to10⁻³ Paonly need30 Seconds);②Between the transmission cavity and the process cavityVacuum isolation valveIt needs to have a zero particle shedding design to avoid surface contamination of the wafer;③Some production lines adoptMagnetic levitation sealing valveReduce wear and extend service life through non-contact sealing 200 Over ten thousand times.

3. Exhaust gas treatment and auxiliary system

Toxic and harmful exhaust gases generated by semiconductor processes (such asCl₂TheHF）The exhaust gas treatment equipment needs to be introduced through a vacuum valve, which must haveCorrosion resistant sealing structure(such as fluororubber seals and Monel alloy valve bodies) to prevent exhaust gas leakage;

The relationship between the vacuum pumping system (molecular pump, diffusion pump) and the process chamberFront valveIt is necessary to have pressure protection function to avoid damage to the pump body caused by sudden changes in chamber pressure.

3、 The technological trend of vacuum valves in the semiconductor industry

1.High cleanliness and low granulationUsing laser welding of the valve body and non lubricated sealing technology, the amount of particles generated inside the valve is controlled within≤1piece/立方米（粒径≥0.1μm）；

2.Intelligence and Remote ControlIntegrate pressure sensors and position sensors to achieve real-time monitoring of valve status and fault warning, and adapt to the automation control needs of semiconductor production lines;

3.Miniaturization and integrationRegarding advanced packagingMicro LEDDevelop compact vacuum valves in segmented fields to reduce equipment space occupation;

4.Adaptation to harsh environments: Targeting3nmDevelop advanced processes below and above to withstand higher temperatures（≥400℃）Lower leakage rate（≤10⁻¹⁵ Pa・m³/s）Ultra high vacuum valve suitable for atomic layer deposition（ALD）Waiting for precision craftsmanship.

Hangzhou Yushi Technology Co., LtdFocusing on providing technical services and solutions related to flow, pressure, vacuum detection and control for industrial and scientific research customers, the company acts as an agent and distributor in the United StatesALICAT、 Swiss Vogtlin, American MKS, Japanese EBARA and other brands, combined with their agent products, provide customers with high-quality flow and pressure monitoring solutions, aiming to improve customers' research and production efficiency, improve their manufacturing processes, and promote their scientific research and innovation progress.