Desktop atomic layer deposition system (ALD) is a nanoscale thin film deposition equipment based on surface self limiting reactions, suitable for laboratory and small-scale industrial scenarios, with high precision, strong shape preservation, and wide material compatibility.
Structural features (desktop advantage)
Miniaturization design: Compact in size (usually desktop or vertical small cabinets), occupying little laboratory space, without the need for separate cleanrooms or large supporting facilities.
The reaction chamber has a small volume (usually several milliliters to tens of milliliters) and low precursor consumption, making it suitable for experimental research on valuable/rare precursors.
Convenience of operation: Equipped with a visual touch interface, supporting graphical editing of deposition programs (setting parameters such as precursor pulse time, purge time, temperature, cycle times, etc.).
Sample loading is simple, and small sample stages (suitable for various sample forms such as wafers, substrates, powders, micro nano devices, etc.) are often used. Some models support automatic sampling.
Mild process conditions: The deposition temperature range is wide (from room temperature to 400 ℃, and some models can reach 500 ℃), which can meet the reaction requirements of different precursors and is suitable for substrates that are not resistant to high temperatures (such as polymers and flexible materials).
The working pressure is mostly atmospheric pressure or low vacuum (10 ⁻¹~10 ⁻³ mbar), without the need for high vacuum units, reducing equipment costs and maintenance difficulties.
Accurate control capability: Equipped with a high-precision Mass Flow Controller (MFC) to accurately control the flow of precursor pulses and inert gas purging.
The temperature uniformity of the sample stage is good (± 1~± 3 ℃), ensuring the thickness uniformity of the film on the substrate surface (non-uniformity<± 2%).
Application scenarios
Semiconductors and Microelectronics: Deposition of high-k gate dielectric thin films (such as Al ₂ O3, HfO ₂) and metal electrode thin films (such as TiN, W) for the research and development of microtransistors and sensors.
New energy materials: depositing protective films (such as LiPON) on the surface of lithium battery electrodes and anti reflective coatings (such as SiO ₂, TiO ₂) on the surface of photovoltaic cells to improve device efficiency and stability.
Functional coatings: Preparation of anti-corrosion coatings, wear-resistant coatings, hydrophobic/superhydrophilic coatings for surface modification of precision instruments.
Nanomaterial modification: Surface coating of nanoparticles, carbon nanotubes, and MOFs to regulate their optical, electrical, and catalytic properties.