High temperature vacuum hot press machineSpecially designed for wafer soldering, thin film transfer, and LCP (liquid crystal polymer) lamination. Heating zone 100mm x 100mm or 300mm x 300mm. The maximum temperature of the equipment can reach 500 ℃, and the maximum pressure is 20-40T.
Main technical parameters:
1. Hot pressing area: 100x100mm or 300x300mm
2. Surface flatness of heating plate: 10um
3. Heating power: 1000W or 6000W
4. Vacuum chamber size&volume: 525Lx480Wx450H (mm) 75L and 572Lx620Wx480H (mm) 170L
5. Maximum pressure: 10T, 20T, 40T
6. Vacuum hot press plate: 2 heating plates, dual temperature control units
7. Hydraulic pump: Maximum displacement of cylinder: 15mm
8. Pressure accuracy:+/-0.01mpa (0.1 kg/cm2)
9. Temperature controller: Maximum heating rate: 2.5 ℃/min
10. Pressure display: digital display of pressure gauge
11 AC208-240V50/60Hz， single-phase
12. Vacuum chamber: There is a vacuum sealed door with a diameter of 300mm on the vacuum chamber, and a quartz observation window with a diameter of 150mm on the door is sealed with a silicone sealing ring
13. Equipment weight: 150KG
How to determine the quality of a high-temperature vacuum hot press machine:
Hardware quality inspection:
Operating status: High quality equipment has low noise and slight vibration, while low-quality equipment has obvious metal impact sound.
Core components: alloy material host (such as screw machine) is preferred, and the motor needs to be copper wire winding. Gas storage tanks should have a pressure vessel manufacturing license.
Security and functional testing:
Safety protection: There must be over temperature protection, over pressure alarm, and emergency stop button.
Continuous operation: It is required to work continuously for more than 10 times without overheating, and observe the temperature of the radiator during testing.