To meet the needs of material research, electronic component testing, ceramic sintering, and high-temperature physical property analysis, Beijing Huace Testing Instrument Co., Ltd. has launched a new generation of temperature control testing platform. This platform integrates temperature control performance, flexible configuration capability, and compatibility, and is designed specifically for research institutions, university laboratories, and manufacturing enterprises to assist users in measuring electrical parameters in different temperature environments.

1、 Technical parameters

Temperature range coverage: Supports a continuously adjustable temperature range from room temperature (RT) to 800 ℃, meeting the research needs of various materials' high-temperature characteristics.

Temperature control accuracy: PID temperature control algorithm is adopted, with a temperature control accuracy of up to ± 0.25 ℃, ensuring high repeatability and reliability of experimental data.

Heating strategy: The heating slope can be customized within the range of 0.5 ℃/min to 20 ℃/min.

High resolution: The temperature resolution reaches 0.1 ℃.

Thermal response capability: The typical heating rate can reach 3 ℃/min and can reach+20 ℃/min.

Probe configuration: Standard rhenium tungsten (Re-W) high-temperature probe, high temperature resistance, suitable for stable contact testing in high-temperature environments.

Equipment compatibility: Seamless adaptation to mainstream source measurement units (SMUs) in the industry, such as Keysight/day setting, plug and play, integrated with existing testing systems.

Sample design: Supports circular or square samples with a diameter of 40mm, balancing universality and practicality.

2、 Application scenarios:

High temperature carrier mobility testing of semiconductor materials

Analysis of Resistance Temperature Characteristics of New Functional Ceramics/Oxides

Thermal stability assessment of phase change materials

Research and development of high-temperature superconducting and thermoelectric materials

Reliability verification of microelectronic devices