X-ray residual stress analyzer

Small and lightweight portableX-ray residual stress analyzer Japanese Pulstec company manufacturing model: μ - X360s

X-ray is one of the few non-destructive testing methods in surface residual stress measurement technology, which determines stress based on changes in the interplanar spacing of materials or products. It is still one of the widely studied, in-depth, and mature residual stress analysis and detection methods, and is widely used in various fields of scientific research and industrial production. In 2012, Pulstec Corporation in Japan developed a new generation based on full two-dimensional detector technologyX-ray residual stress analyzer——μ-X360n， The measurement speed and accuracy of residual stress using X-rays have been pushed to a new height, and the equipment has received praise from the industry shortly after its launch. Due to its advanced technology, high repeatability of test data, and portability, the device has been highly favored by the industry since its launch!

Recently, Pulstec, a Japanese company, has successfully overcome technical difficulties and released a new product model, the μ - X360J, after the μ - X360n and μ - X360sImprove the product design and functionality of the full two-dimensional surface detector technology once again!

Product Point:

Compared to traditional X-ray residual stress measuring instruments, the μ - X360 series based on full two-dimensional detector technology has the following advantages:

Faster: The two-dimensional detector can capture the complete Debye ring through secondary acquisition, and the measurement can be completed with a single angle incident.

More accurate: one measurement can obtain500 diffraction peaksFitting residual stress data yields more accurate results.

Easier: No need for a goniometer, single angle incidence is sufficient, and measuring complex shapes and narrow spaces is no longer difficult.

More convenient: No need for any liquid cooling device, supports portable battery power supply.

More powerful: equipped with regional stress measurement function, grain uniformity, material texture, residual austenite analysis and other functions.

Grain orientation analysis	Grain uniformity analysis

Application domain:

1. Mechanical processing domain: measuring residual stresses in components such as machine tools, welding, casting, forging, and cracking.

2. Metallurgical industry: Measurement of residual stress in industrial production components such as hot pressing, cold pressing, ironmaking, steelmaking, and casting.

3. Manufacturing of various spare parts: measuring residual stresses in industrial products such as power plant steam turbine manufacturing, engine manufacturing, oil cylinders, pressure vessels, pipelines, ceramics, assembly, bolts, springs, gears, bearings, rollers, crankshafts, piston pins, universal joints, shafts, blades, cutting tools, etc.

4. Surface modification treatment: Measure the residual stress in components treated by processes such as nitriding, carburizing, carbonitriding, quenching, hardening, shot blasting, vibration impact, extrusion, rolling, diamond rolling, cutting, grinding, turning (milling), mechanical polishing, and electrical polishing.

5. Basic infrastructure for people's livelihood:

(1) Marine domain: measuring residual stress of equipment and facilities in areas such as ships, oceans, petroleum, chemical, lifting, transportation, ports, etc.

(2) Energy domain: Measuring residual stresses in equipment and facilities in the nuclear industry, electricity (hydro, hydro, thermal, and nuclear power), water engineering, natural gas engineering, and other fields.

(3) Infrastructure engineering domain: measuring residual stresses in materials, components, and other related equipment and facilities used in excavation, bridges, automobiles, railways, aerospace, transportation, steel structures, and other engineering domains.

6. Defense sector: MeasurementwuqiResidual stress of equipment, heavy equipment and other products.

Overview of Testing Principles:

Full two-dimensional surface detector technology

--After a single angle incident, a complete Debye ring is obtained using a two-dimensional detector. Calculate the change in interplanar spacing under stress and the corresponding stress by comparing the difference between the Debye ring without stress and the deformed Debye ring under stress
--After applying stress, analyzing the changes in the Debye ring before and after a single incident can obtain residual stress data through residual stress analysis software

Application software:

1. Use a full two-dimensional detector to obtain the complete Debye ring, and stress measurement can be completed by X-ray single angle incidence

2. Fully automatic software measures residual stress and can display the half peak width value

3. Internal positioning markers and CCD cameras facilitate sample positioning, making operation simple and fast

4. Quickly enter the preset measurement conditions for various materials and execute the measurement with the key