Wafer bonding machine

AML wafer bonding machine in the UKWWW.AML. CO.UK
AML (Applied Microengineering Ltd) was established in 1992. The company is located in Harvard Science Park, Oxford, UK, and mainly engages in the production of in-situ wafer bonding equipment. With the support of BONDCENTER, which has billions of pounds of high-end modern equipment, it provides customers with bonding related services.
The alignment bonding machine produced by the company is currently the only device on the market that can achieve in-situ alignment, excitation, and bonding on the same device. It is a MEMS, IC, The best choice for III-V bonding process. While achieving in-situ bonding, this device is also used for embossing, printing, nanoimprinting, and other graphic transfer technologies. Can be used for scientific research and has fully automated equipment suitable for mass production.
AML BONDCENTER provides customers with the best location for manufacturing bonding substrates, bonding devices, 3D integration, and chip level packaging.
AML bonding machine
Wafer alignment bonding machine, widely used in MEMS devices, wafer level packaging technology (WLP), advanced vacuum packaging substrates, TSV 3D interconnect processes, etc

AML bonding machines have unique in-situ wafer alignment bonding technology:
In situ excitation, alignment, and bonding can be completed in one station
The bonding alignment accuracy can reach 1 um
Suitable for various bonding methods, including:
-Anodic bonding
-Eutectic bonding
-Glass paste bonding
-Hot press bonding
-Direct bonding (high temperature&low temperature)
-Adhesive bonding (UV curing&UV curing)
Key cooperative force intelligent control
Image acquisition function, used to identify the alignment mark on the back
The chip or wafer size range is 2 "-12"