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2nd Floor, Building B, Jingang Technology Park, Qiaotou, Fuyong Street, Bao'an District, Shenzhen
Shenzhen Yunteng Laser Technology Co., Ltd
2nd Floor, Building B, Jingang Technology Park, Qiaotou, Fuyong Street, Bao'an District, Shenzhen
Welcome to personalized customization
A professional customization team can provide personalized customization services according to the needs of customers. If you have such needs, please feel free to consult the customer service hotline: 13751030658.
Welcome to free sampling
Yunteng Laser can provide free sampling services. For technical consultation, process consultation, product consultation, and transportation consultation, please call directly!
Welcome to visit in person
Yunteng Laser's product quality is industry-leading. Welcome to visit and inspect the company on site! Multiple companies designated laser brands and witnessed together.
Industry applications:
Solar panel sapphire&glass cover, optical glass, semiconductor packaging chips, silicon wafers&ceramic substrates and other brittle materials, thermosensitive polymer&inorganic materials, micro drilling, etching.
Specific applications include:
1. Mobile phone cover and optical lens shape cutting 5, precision micro gear cutting
2. Semiconductor integrated circuit chip cutting 6, micro drilling of engine fuel injectors
3. Optical lens shape cutting drilling 7, LCD panel cutting
4. Precision Sensor Micro Drilling 8, Organic&Inorganic Materials New Flexible Display or Micro Electronic Circuit Etching&Cutting
Advantages of the machine:
1. Using picosecond or femtosecond lasers, ultra short pulse processing with almost no thermal conduction, suitable for high-speed cutting and drilling of any organic and inorganic material, with a minimum of 3μThe collapse edge and heat affected zone of m.
2. Adopting single laser dual path splitter mirror technology, efficiency is improved in laser etching, drilling small circular holes, and other aspectsIncrease by 100 times.
3. CCD visual pre scanning&automatic target positioning, maximum processing range 650mm × 450mm, XY platform splicing accuracy ≤± 3μm。
4. Support multiple visual positioning features, such as cross, solid circle, hollow circle, L-shaped right angle edge, image feature points, etc.
5. Automatic fragment cleaning, visual inspection sorting, and robot automatic loading and unloading.
6. With 6 years of research and development technology accumulation in laser microfabrication systems, and selection of key components for world-class brands, we have been able to work continuously for 7 × 24 hours without any malfunctions, resulting in higher actual production capacity.
Technical specifications and parameters
| Serial Number | project | Technical Parameter |
| optical unit | ||
| 1 | Laser type | 355, 532, 1064nm available in 10ps |
| 2 | Cooling method | Constant temperature water cooling |
| 3 | laser power | 10~100W |
| 4 | Beam Quality | M²<1.3 |
| 5 | Focusing method&number of processing heads | Single point&flat field focusing lens, dual head |
| 6 | Minimum focused spot diameter | Ф3--15μm |
| Laser processing performance | ||
| 7 | Processing speed | 100~3000mm/s adjustable |
| 8 | Minimum collapse edge | 3μm |
| 9 | Maximum processing material thickness | 2mm |
| 10 | Maximum machining size&accuracy | 12inches, ±5μm |
| Mechanical unit | ||
| 11 | machine tool structure | Gantry |
| 12 | Number and types of machine tool motion axes | Up to 8 axes, X, Y, Z,&θ axes |
| 13 | Maximum platform travel and speed | 650mm×450mm,800mm/s |
| 14 | Repetitive accuracy of motion platform | ≤±1μm |
| 15 | Positioning accuracy of sports platform | ≤±3μm |
| Software control unit | ||
| 16 | Laser Processing&Platform Control | Strongsoft, Strongsmart |
| 17 | Processing file import format | Dxf, Plt, DWG, Gebar |
| 18 | CCD visual positioning software | AISYS Vision |
| 19 | CCD visual positioning accuracy | ≤±3μm |
| Electrical unit | ||
| 20 | plc controller | Panasonic |
| 21 | vacuum system | vacuum pump |
| 22 | Dust removal&collection system | Professional dust filtration integrated purification machine |
| Automation unit | ||
| 23 | Automatic loading and unloading system | XZ axis+movable loading and unloading platform |
| Advanced optional units | ||
| 24 | AOI Visual Inspection | 8-12 inch large sheet/3 minutes |
| 25 | Automatic fragmentation function | 8-12 inch large sheet/3 minutes |
| 26 | Automatic cleaning and sorting | 8-12 inch large sheet/3 minutes |
| Installation environment | ||
| 27 | Whole machine power supply&voltage regulator power | 220V380V,8KW |
| 28 | compressed air pressure | ≥0.6MPa |
| 29 | Cleanroom level | 10000 |
| 30 | Ground bearing capacity | 2T/m² |
| 31 | Protect nitrogen gas | High purity nitrogen |
Cutting and drilling samples:






Quick laser drilling! Mp4 (performing ultrafast laser)Drill 100 holes with a diameter of 3mm per second)
Why choose Yunteng Laser:
First class R&D team