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Sumitomo Conductive Silver Adhesive T-3007-20 from Japan

NegotiableUpdate on 01/19
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Overview
Product type: Conductive silver adhesive Product model: T-3007-20 Silver content: 78~82% Structure: Flake viscosity: 15~25/pas Specific gravity: 3
Product Details

Product Type: Conductive Silver Adhesive

Product model:T-3007-20

Silver content:78~82%

Structure: Sheet like

Viscosity:1525/pas

Specific gravity:3.6±0.2

Curing conditions:150/30min

Discharge temperature:50

Packaging: Canned:200gms

Thermal expansion coefficient:LESS:Tg9×10-5/OVER:Tg5×10-4/

Glass transition point temperature:120140

Thermal conductivity coefficient:1.2w/m·k

Next, intensity:1.5mm×1.5mm Si Chipexist150/30In minutes,68.7N1.5mm×1.5mm Si Chipexist350℃×20In seconds,12.1N

storage: -15~-40/6Month

Return to refrigeration time when the remaining materials are not in use:1Within hours

precautions:

Ensure that the adhesive is opened after reaching room temperature to prevent condensation. Do not artificially accelerate the temperature return. ·It is necessary to avoid direct sunlight and exposure to high humidity outside the refrigerator

environment ·Please remove the syringe from the dry refrigerator immediately without any delay upon receipt of the goods

Transfer internally to-15~-40°CInside the refrigerator to avoid the formation of bubbles. Bubbles in the hose can be removed using a centrifuge.