Spin Dryer centrifugal spin dryer OKK semiconductor wafer dryer

The Japan OKK Omiya Industrial Spin Dryer SPD series is a wafer centrifugal dehydration equipment designed specifically for semiconductor manufacturing processes, mainly used for efficient and pollution-free drying of cleaned wafers (2-12 inches). This series of equipment relies on OKK's original automatic balancing technology (FAB) and is designed to be compatible with cleanrooms, achieving low vibration, high cleanliness dehydration, avoiding particle contamination, and suitable for wet treatment after the previous process.. Japanese SPINDRYER wafer cleaning machine for semiconductor industry.

The Omiya Kogyo SPD series from Japan is a high-precision centrifugal spin dryer specially developed for semiconductor wafers. It is mainly used for efficient and clean dehydration after wafer cleaning and is a key equipment in semiconductor manufacturing processes.

Application scenarios and technological advantages

Core application: Dehydration of semiconductor wafers after cleaning, combined with Spin Rinse Dryer (SRD) system to achieve an integrated process of "rinsing and drying".

Cleaning and drying of semiconductor silicon wafers

Drying of compound semiconductor (GaAs, SiC, GaN) wafers

Clean and dry photomask/glass substrate, precision electronic components

Suitable for mainstream 8-inch and 12 inch processes

Technical highlights:

FAB (Full Automatic Balancing): Automatically balances the weight difference of 1-25 wafers without the need for dummy wafers.

Cleanroom compatibility: Built in ULPA filter continuously introduces clean air to prevent particle contamination.

Vibration free design: Based on vibration analysis technology, high-precision rotation is achieved to ensure the integrity of the wafer surface.

Typical customers: Global wafer foundries, semiconductor packaging and testing factories, microelectronics research and development laboratories.

Product Evolution and Substitution Relationship

The SPD series is an early product line of OKK, which has gradually been replaced by the OKH series (Horizon type) and OKV series (Vertical type):

OKH series: Horizontal design, supports simultaneous drying of dual/four vehicles, suitable for high-capacity production lines.

OKV series: Vertical structure, small footprint, suitable for research and development and small batch production.

SPD160RN/SPD180RN/H840A/H1120RN/SPD-100/SPD-200/SPD-300/

Japanese SPINDRYER wafer cleaning machine for semiconductor industry OKH-MRCleaning and drying integrated machineOne stop processing for wafers, ceramics, glass, and precision partsSimultaneously spraying pressurized gas and micronized pure water, 6-speed (10-600 min ⁻¹), 10 process formulas, supporting N ₂ inert gas

OKV-600 series (standard vacuum spin drying)

Representative models: OKV-600, OKV-600S

Positioning: Vacuum drying of 6-inch wafers/small precision parts

Core Features

Vacuum environment+centrifugal rotation, anaerobic oxidation prevention, low-temperature rapid dehydration

Standard ion generator+ULPA filtration, with a cleanliness level of 100

Variable frequency speed regulation (10-600 rpm), multi-stage program, timed control

Fully sealed SUS316L chamber, electrolytic grinding, low dust generation, corrosion-resistant

Applicable: 6-inch wafers, ceramic substrates, optical lenses, medical devices

2. OKV-800 series (large/heavy-duty vacuum drying)

Representative models: OKV-800, OKV-800SA

Positioning: Vacuum drying of 8/12 inch wafers and large-sized/large batch workpieces

Core Features

High rigidity cavity, high-precision dynamic balance, low vibration under heavy load

Dual mode of vacuum and hot air flow, more uniform drying and higher efficiency

Automatic doors, safety interlocks, vacuum leak detection

Support N ₂ inert gas replacement and enhance oxidation resistance

Applicable: 12 inch wafers, large substrates, batch precision components

3. OKV-MR series (vacuum+cleaning integrated)

Representative model: OKV-MR

Positioning: Integrated cleaning and drying under vacuum environment

Core Features

Simultaneous completion of particle cleaning and vacuum centrifugal drying inside the vacuum chamber

Completely anaerobic throughout the process, eliminating oxidation and secondary pollution

10 sets of process formulas, suitable for multi material workpieces

Applicable: One stop processing of high-value, easily oxidizable precision parts

Spin Dryer centrifugal spin dryer OKK semiconductor wafer dryer

Spin Dryer centrifugal spin dryer OKK semiconductor wafer dryer