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Dongguan Qinzhuo Environmental Testing Equipment Co., Ltd
Small chip semiconductor hanging basket high and low temperature impact testing equipment
NegotiableUpdate on 05/06
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Overview
Small chip semiconductor hanging basket high and low temperature impact testing equipment, specially designed for chips IC、 The reliability environment testing equipment for precision electronic components such as semiconductor devices, wafers, sensors, and micro connectors, with its core advantages of compact size, precise temperature control, and rapid impact, is widely used in semiconductor research and development, quality inspection, incoming material testing, and other scenarios. It provides scientific and accurate testing support for the performance verification of micro components in environments with sudden temperature changes, helping enterprises improve product quality and market competitiveness.
Product Details
Small chip semiconductor hanging basket high and low temperature impact testing equipmentIt is specifically designed for chips IC、 The reliability environment testing equipment for precision electronic components such as semiconductor devices, wafers, sensors, and micro connectors, with its core advantages of compact size, precise temperature control, and rapid impact, is widely used in semiconductor research and development, quality inspection, incoming material testing, and other scenarios. It provides scientific and accurate testing support for the performance verification of micro components in environments with sudden temperature changes, helping enterprises improve product quality and market competitiveness.
The equipment adopts a compact design as a whole, with a small and exquisite body, occupying only one-third to one-half of the space of conventional equipment. It does not require a large amount of space and can be flexibly placed in laboratories, research and development rooms, clean workshops and other places. It is easy to install and does not require complex site modifications. It can be debugged and used immediately after power on, greatly adapting to the space requirements of precision testing scenarios in the semiconductor industry. At the same time, the appearance of the equipment is made of corrosion-resistant and easy to clean high-quality boards, with a smooth and flat surface that meets the environmental requirements of the clean workshop, avoiding dust and impurities from contaminating the chip samples.
In terms of core testing performance, the equipment adopts a two box impact structure and is controlled by high-precision air duct valves to achieve rapid switching between high and low temperature zones. The temperature conversion time is short, and the impact response is fast. It can instantly switch from high temperature to low temperature or from low temperature to high temperature, simulating the sudden temperature changes that the chip may encounter during transportation, storage, and use. It accurately detects potential problems such as packaging cracking, solder joint failure, pin detachment, and functional abnormalities during the thermal expansion and contraction process of the chip.
The temperature control system is the core highlight of the equipment, using imported high-precision temperature control sensors and intelligent PID adjustment algorithms. It has high temperature control accuracy and small temperature fluctuations. The temperature range in the high temperature zone can reach+80 ℃ -+200 ℃, and the temperature range in the low temperature zone can reach -40 ℃ -80 ℃. The impact temperature and holding time can be flexibly adjusted according to the chip testing requirements. The equipment adopts a special air duct design internally, with uniform airflow and excellent temperature field uniformity, ensuring that all parts of the chip sample are heated and cooled evenly, avoiding local temperature deviations that affect the accuracy of test results, and meeting semiconductor industry related testing standards such as JESD22, AEC-Q100, GB/T 2423.
The control system adopts a 7-inch intelligent touch screen, with an intuitive and easy to understand operating interface, supporting multi segment program editing, cyclic impact testing, timed holding, parameter locking and other functions. Multiple testing schemes can be preset to meet the needs of different chips and testing standards. At the same time, the equipment is equipped with data recording and export functions, which can record key data such as temperature change curves and impact times in real time during the testing process. It supports USB export, facilitating the traceability, analysis, and archiving of testing data, helping R&D personnel optimize product design, and quality inspection personnel efficiently complete quality testing.
To ensure the safety of testing and stable operation of the equipment, the device is equipped with a safety protection system that integrates multiple protection mechanisms such as over temperature protection, overload protection, leakage protection, water shortage alarm, and automatic shutdown due to faults. When the device experiences temperature abnormalities, circuit faults, or other situations, it will immediately issue an alarm signal and automatically shut down, effectively avoiding damage to chip samples and the expansion of equipment faults. In addition, the equipment adopts an independent and efficient refrigeration circuit and a reliable heating system, which has high refrigeration and heating efficiency, low energy consumption, low operating noise, can operate continuously and stably for a long time, low failure rate, and reduces equipment maintenance costs.
The internal testing chamber volume of the equipment has been scientifically designed to accommodate various small chips IC、 The placement of micro samples such as wafers can be flexibly matched with specialized fixtures according to the sample size to ensure that the samples are firmly fixed and there is no displacement or damage during the testing process. At the same time, the testing chamber adopts a high sealing design, with excellent insulation and cooling performance, effectively reducing temperature loss, improving testing efficiency, reducing energy consumption, and balancing testing performance and economy.
As a precision testing equipment in the semiconductor chip industry, this equipment can be widely used in the research and development verification, incoming material testing, and factory quality inspection of consumer electronics chips, automotive electronics chips, industrial control chips, sensors, wafers, and other products. It can quickly and accurately detect the temperature shock resistance of products, help enterprises detect potential defects in products in advance, optimize production processes, improve product reliability and service life, and provide solid guarantees for quality control of semiconductor products. It is an ideal testing equipment for laboratories, research and development enterprises, and semiconductor manufacturers.
Small chip semiconductor hanging basket high and low temperature impact testing equipment
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