Picosecond laser sapphire cutting machine
Welcome to personalized customization
A professional customization team can provide personalized customization services according to the needs of customers. If you have such needs, please feel free to consult the customer service hotline: 13751030658.
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Yunteng Laser can provide free sampling services. For technical consultation, process consultation, product consultation, and transportation consultation, please call directly!
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Yunteng Laser's product quality is industry-leading. Welcome to visit and inspect the company on site! Multiple companies designated laser brands and witnessed together.
Product Introduction:
LUD2210 adopts a new picosecond laser processing technology, which is particularly suitable for efficient cutting of sapphire window protection sheets for mobile phones. Compared to the ablative cutting process, the customized wire cutting process of Yunteng Laser has more advantages, such as higher cutting speed, smaller edge breakage, and no taper. This device is also suitable for high-speed processing of glass cover plates and optical protective lenses, with a wide range of applications.
● Adopting a new technology of picosecond laser processing for efficient cutting of transparent materials such as sapphire and glass.
High machining dimensional accuracy, no taper, and edge breakage less than 10um.
Picosecond laser has good beam quality, small focused spot, small power fluctuation, and ensures stable processing quality.
Precision optical path design ensures high-quality laser transmission.
Equipped with high-speed and high-precision linear motors.
Equipped with an automated processing system.
Application areas: Sapphire camera cover, Home button, optical glass cover, etc.
Technical parameters:
| Product model |
LUD2210 |
Laser parameters
(Different depending on the application) |
average output power |
50W |
| pulse width |
10 ps |
| wavelength |
1064 nm |
| Linear motor parameters |
Effective work schedule |
400 x 400 mm |
| Linear motor accuracy |
±1um |
| CCD |
optional |
Sapphire processing technology indicators
(Different depending on the material) |
chipping |
＜10um |
| conicity |
＜2° |
Strength of sapphire after processing
(Different depending on the material) |
minimum |
500 MPa |
| maximum |
800 MPa |
| automation system |
standard configuration |
Cutting speed
(Different depending on the material) |
|
0.3mm thick sapphire
2 seconds per piece for a 10mm circular disc |
Why choose Yunteng Laser:
First class R&D team
85% of the company's employees have a college degree or above, and more than half of the total number of technical R&D personnel, among which R&D backbone personnel represent the top level in the industry.
Rich industry experience
Since its establishment in 2013, the company has gone through ups and downs, relying on first-class professional technology and strong research and development advantages, successfully providing laser equipment and application services to nearly 300 enterprises in different industries, and accumulating rich industry experience.
Integrated solution
The company has always adhered to the market-oriented approach and taken it as its responsibility to meet the actual needs of customers. Over the years, the company has independently developed and completed industry benchmark projects such as TP silver paste line+ITO automatic positioning etching system for touch screen industry, FPC+PCB high-precision automatic feeding and cutting system, laying a solid foundation for future development!
Focusing on professional cooperation and mutual benefit has been our driving force for many years!
Free solution design
Free sample evaluation
Free quotation consultation
Free trial of standard machines
Please consult relevant business personnel for details.
Sample display:
