Picosecond laser cutting equipment for brittle materials

Welcome to personalized customization

Industry applications:

Brittle materials such as sapphire&glass cover plates, optical glass, semiconductor packaging chips, sapphire&silicon wafers&ceramic substrates, thermosensitive polymers&inorganic materials, micro drilling, cutting.

Specific applications include:

1. Cutting of phone cover and optical lens shape

2. Fingerprint recognition chip cutting

3. Optical lens shape cutting

4. LCD panel cutting

5. New flexible displays or micro electronic circuit etching and cutting of organic and inorganic materials.

Advantages of the machine:

1. The equipment of Yunteng Laser adopts picosecond or femtosecond lasers, with ultra short pulse processing without thermal conduction, suitable for high-speed cutting and drilling of any organic and inorganic materials, with a minimum of 10MThe collapse edge and heat affected zone of m.

2. Adopting single laser dual path splitting technology, dual laser head processing, efficiency improvementDouble the amount.

3. CCD visual pre scanning&automatic target positioning, maximum processing range of 650mm × 450mm, XY platform splicing accuracy of ≤± 3 μ m.

4. Support multiple visual positioning features, such as cross, solid circle, hollow circle, L-shaped right angle edge, image feature points, etc.

5. Automatic cleaning, visual inspection and sorting, automatic loading and unloading.

6. 6 years of research and design technology accumulation in laser microfabrication systems, stable performance, and no consumables.

Principle of picosecond laser surface ablation cutting:

The high peak power laser beam is focused on the surface of brittle materials through a flat field scanning objective under the movement reflection of a scanning galvanometer. The scanning galvanometer controls the laser beam to perform multiple repeated circular motions, gradually eroding the surface of the material. The material is instantly heated by the high-density peak power laser and rapidly rises to the plasma gasification temperature, causing the material to gradually be ablated by the laser and escape from the material surface in the form of gas, thereby achieving material cutting and separation.

Technical specifications and parameters

Sample display:

Why choose Yunteng Laser:

First class R&D team

85% of the company's employees have a college degree or above, and more than half of the total number of technical R&D personnel, among which R&D backbone personnel represent the top level in the industry.

Rich industry experience

Since its establishment in 2013, the company has gone through ups and downs, relying on first-class professional technology and strong research and development advantages, successfully providing laser equipment and application services to nearly 300 enterprises in different industries, and accumulating rich industry experience.

Integrated solution

The company has always adhered to the market-oriented approach and taken it as its responsibility to meet the actual needs of customers. Over the years, the company has independently developed and completed industry benchmark projects such as TP silver paste line+ITO automatic positioning etching system for touch screen industry, FPC+PCB high-precision automatic feeding and cutting system, laying a solid foundation for future development!

Internal design drawings:

Focusing on professional cooperation and mutual benefit has been our driving force for many years!

Free solution design

Free sample evaluation

Free quotation consultation

Free trial of standard machines

Please consult relevant business personnel for details.