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Shenzhen Yunteng Laser Technology Co., Ltd
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Picosecond glass drilling and cutting

NegotiableUpdate on 02/08
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Overview
Picosecond glass drilling and cutting
Product Details

Welcome to personalized customization

A professional customization team can provide personalized customization services according to the needs of customers. If you have such needs, please feel free to consult the customer service hotline: 13751030658.

Welcome to free sampling

Yunteng Laser can provide free sampling services. For technical consultation, process consultation, product consultation, and transportation consultation, please call directly!

Welcome to visit in person
Yunteng Laser's product quality is industry-leading. Welcome to visit and inspect the company on site! Multiple companies designated laser brands and witnessed together.

Industry applications:

Brittle materials such as sapphire&glass cover plates, optical glass, semiconductor packaging chips, sapphire&silicon wafers&ceramic substrates, thermosensitive polymers&inorganic materials, micro drilling, cutting.

Specific applications include:

1. Mobile phone cover and optical lens shape cutting 5, precision micro gear cutting

2. Semiconductor integrated circuit chip cutting 6, micro drilling of engine fuel injectors

3. Optical lens shape cutting drilling 7, LCD panel cutting

4. Precision Sensor Micro Drilling 8, Organic&Inorganic Materials New Flexible Display or Micro Electronic Circuit Etching&Cutting


Advantages of the machine:

1. Using picosecond or femtosecond lasers, ultra short pulse processing with almost no thermal conduction, suitable for high-speed cutting and drilling of any organic and inorganic material, with a minimum of 3MThe collapse edge and heat affected zone of m.

2. Adopting single laser dual path splitting technology, dual laser head processing, efficiency improvementDouble the amount.

3. CCD visual pre scanning&automatic target positioning, maximum processing range 650mm × 450mm, XY platform splicing accuracy ≤± 3Mm。

4. Support multiple visual positioning features, such as cross, solid circle, hollow circle, L-shaped right angle edge, image feature points, etc.

5. Automatic fragment cleaning, visual inspection sorting, and robot automatic loading and unloading.

6. With 6 years of research and development technology accumulation in laser microfabrication systems, and selection of key components for world-class brands, we have been able to work continuously for 7 × 24 hours without any malfunctions, resulting in higher actual production capacity.

Technical specifications and parameters

serial number project Technical Specifications
Optical unit
1 Laser type 355, 532, 1064nm available in 10ps
2 cooling method Constant temperature water cooling
3 laser power 10~100W
4 Beam quality M²<1.3
5 Focusing method&number of processing heads Single point&flat field focusing lens, dual head
6 Minimum focused spot diameter

F3--15Mm

Laser processing performance
7 processing speed 100~3000mm/s adjustable
8 Minimum collapse edge 3μm
9 Maximum processing material thickness 2mm
10 Maximum machining size&accuracy 12inches, ±5μm
Mechanical unit
11 Machine tool structure gantry type
12 Number and types of machine tool motion axes Up to 8 axes, X, Y, Z,&θ axes
13 Maximum platform travel and speed 650mm×450mm,800mm/s
14 Repetitive accuracy of motion platform ≤±1μm
15 Positioning accuracy of sports platform ≤±3μm
Software control unit
16 Laser Processing&Platform Control Strongsoft, Strongsmart
17 Processing file import format Dxf, Plt, DWG, Gebar
18 CCD visual positioning software AISYS Vision
19 CCD visual positioning accuracy ≤±3μm
Electrical unit
20 PLC controller Panasonic
21 vacuum system vacuum pump
22 Dust removal&collection system Professional dust filtration integrated purification machine
Automation unit
23 Automatic loading and unloading system XZ axis+movable loading and unloading platform
Advanced optional units
24 AOI Visual Inspection 8-12 inch large sheet/3 minutes
25 Automatic fragmentation function 8-12 inch large sheet/3 minutes
26 Automatic cleaning and sorting 8-12 inch large sheet/3 minutes
Installation environment
27 Whole machine power supply&voltage regulator power 220V380V,8KW
28 Compressed air pressure ≥0.6MPa
29 Cleanroom level 10000
30 Ground bearing capacity 2T/m²
31 Protect nitrogen gas High purity nitrogen


Cutting and drilling samples:

盛雄激光-2.jpg

Why choose Yunteng Laser:

First class R&D team

85% of the company's employees have a college degree or above, and more than half of the total number of technical R&D personnel, among which R&D backbone personnel represent the top level in the industry.

Rich industry experience

Since its establishment in 2013, the company has gone through ups and downs, relying on first-class professional technology and strong research and development advantages, successfully providing laser equipment and application services to nearly 300 enterprises in different industries, and accumulating rich industry experience.

Integrated solution

The company has always adhered to the market-oriented approach and taken it as its responsibility to meet the actual needs of customers. Over the years, the company has independently developed and completed industry benchmark projects such as TP silver paste line+ITO automatic positioning etching system for touch screen industry, FPC+PCB high-precision automatic feeding and cutting system, laying a solid foundation for future development!


Internal Design Drawing (Reference):

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Focusing on professional cooperation and mutual benefit has been our driving force for many years!

Free solution design

Free sample evaluation

Free quotation consultation

Free trial of standard machines

Please consult relevant business personnel for details.