PCB high-speed laser drilling

Welcome to personalized customization

Industry applications:

1. PCB industry HDI drilling

2. Chip inductor ceramic drilling

3. Micro drilling of TSV process in semiconductor microelectronics industry

4. Drilling holes for engine fuel injectors

Advantages of the machine:

1. Using picosecond laser, ultra short pulse processing without thermal conduction, suitable for high-speed drilling of ceramic thin film materials.

2. Adopting single laser dual path splitting technology and dual laser head processing, the efficiency is doubled.

3. Drilling speed up to 2000 holes/s, minimum aperture 10Mm， The roundness is over 95%, and the edge of the small hole is smooth without burrs.

4. CCD visual pre scanning&automatic target positioning, maximum processing range of 650mm × 450mm, XY platform splicing accuracy of ≤± 3 μ m.

5. Support multiple visual positioning features, such as cross, solid circle, hollow circle, L-shaped right angle edge, image feature points, etc.

6. Fully automatic loading and unloading system, unmanned operation.

7. 8-year accumulation of research and design technology for laser microfabrication systems, stable performance, and no consumables.

Principle of Picosecond Laser Micro Drilling:

Picosecond laser relies on its extremely high peak power,Through the accumulation of a single pulse or the spiral motion of multiple pulses, a huge amount of energy is transmitted to the surface of the material in a short period of time, causing the material to be instantly melted and evaporated. The higher the energy of a single laser pulse, the more material is vaporized. During the evaporation process, the volume of the material in the hole rapidly expands, generating a large pressure. This vapor pressure pushes the denatured workpiece material out of the hole, and due to the picosecond pulse width of the laser, the thermal effect is negligible. The roundness of the borehole is relative to that of CO₂The laser is smoother and the edges are neater.

Technical specifications and parameters

Sample display:

Why choose Yunteng Laser:

First class R&D team

85% of the company's employees have a college degree or above, and more than half of the total number of technical R&D personnel, among which R&D backbone personnel represent the top level in the industry.

Rich industry experience

Since its establishment in 2013, the company has gone through ups and downs, relying on first-class professional technology and strong research and development advantages, successfully providing laser equipment and application services to nearly 300 enterprises in different industries, and accumulating rich industry experience.

Integrated solution

The company has always adhered to the market-oriented approach and taken it as its responsibility to meet the actual needs of customers. Over the years, the company has independently developed and completed industry benchmark projects such as TP silver paste line+ITO automatic positioning etching system for touch screen industry, FPC+PCB high-precision automatic feeding and cutting system, laying a solid foundation for future development!

Focusing on professional cooperation and mutual benefit has been our driving force for many years!

Free solution design

Free sample evaluation

Free quotation consultation

Free trial of standard machines

Please consult relevant business personnel for details.