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B108, No. 352 Outer Ring Road, Minhang District, Shanghai (201199)
Shanghai Yifeng Precision Instrument Co., Ltd
B108, No. 352 Outer Ring Road, Minhang District, Shanghai (201199)
SuperView W1Optical 3D surface profilometerIt is a detection instrument used for sub nanometer level measurement of various precision devices and material surfaces. It is an optical detection instrument that uses white light interference technology as the principle, combined with precision Z-direction scanning module, 3D modeling algorithm, etc. to perform non-contact scanning of the device surface and establish surface 3D images. The system software processes and analyzes the 3D images of the device surface, and obtains 2D and 3D parameters reflecting the surface quality of the device, thereby achieving 3D measurement of the device surface morphology.
SuperView W1 optical 3D surface profilometer can be widely used in semiconductor manufacturing and packaging process testing, 3C electronic glass screens and their precision accessories, optical processing, micro nano materials and manufacturing, automotive parts, MEMS devices and other ultra precision processing industries, as well as aerospace, defense industry, research institutes and other fields. Can measure surfaces of various objects ranging from ultra smooth to rough, low reflectivity to high reflectivity, and workpieces ranging from nanometer to micrometer levelsProvide basis for roughness, flatness, micro geometric contour, curvature, etcISO/ASME/EUR/GBT four major domestic and international standardsTotal standards300Kinds2D、3DParameters serve as evaluation criteria.
1) The measurement and analysis software for integrated operation does not require switching interfaces. The configuration parameters are pre-set before measurement, and the software automatically collects measurement data and provides data report export function, which can quickly achieve batch measurement function.
2) Automatic multi area measurement function, batch measurement, automatic focusing, automatic brightness adjustment and other automation functions are provided in the measurement.
3) Provide splicing measurement function during measurement.
4) In the analysis, the data processing functions of four modules are provided, namely, position adjustment, correction, filtering, and extraction. The position adjustment includes image leveling, mirroring, and other functions; Correction includes functions such as spatial filtering, contouring, and peak denoising; Filtering includes functions such as removing external shapes, standard filtering, and filtering spectra; Extraction includes functions such as extracting regions and extracting profiles.
5) The analysis provides five major analysis functions, including roughness analysis, geometric contour analysis, structural analysis, frequency analysis, and functional analysis. Among them, roughness analysis includes full parameter analysis functions based on international standards such as ISO4287 line roughness, ISO25178 surface roughness, ISO12781 flatness, etc; Geometric contour analysis includes measurement of features such as step height, distance, angle, and curvature, as well as evaluation of straightness, roundness, and positional tolerances; Structural analysis includes pore volume and valley depth, etc; Frequency analysis includes functions such as texture direction and spectral analysis; Functional analysis includes functions such as SK parameters and volume parameters.
6) Provide auxiliary analysis functions such as one click analysis and multi file analysis in the analysis, set analysis templates, and combine the automatic measurement and batch measurement functions provided in the measurement to achieve small size analysisThe function of batch measurement of precision components and direct acquisition of analytical data.
Measure and analyze surface morphology features such as flatness, roughness, waviness, surface contour, surface defects, wear, corrosion, pore gaps, step height, bending deformation, and processing of various products, components, and materials.
Application example:
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semiconductor. Polishing silicon wafers, thinning silicon wafers, wafer ICs |
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3C Electronics Sapphire glass roughness, defects in mobile phone metal shell molds, and height differences in mobile phone ink screens |
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Ultra precision machining optical lens |
Precision machining Engine blades |
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Precision machining Pyramid shaped diamond magnetic head |
Standard sample block Single engraved step, multi engraved roughness |
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1High precision, high repeatability
1) The measurement system is composed of optical interference technology, precision Z-direction scanning module, and excellent 3D reconstruction algorithm to ensure high measurement accuracy;
2) The unique isolation system can effectively isolate the majority of vibrations with frequencies above 2Hz, eliminate ground vibration noise and sound wave vibration noise in the air, ensure stable use of the instrument in most production workshop environments, and achieve extremely high measurement repeatability;
2Measurement and analysis software for integrated operation
1) Measurement and analysis are operated on the same interface without switching, and the measurement data is automatically counted, achieving the function of rapid batch measurement;
2) Visual window, convenient for users to observe the scanning process in real time;
3) Combined with the automated measurement function of custom analysis templates, it can automatically complete the measurement and analysis process of multiple areas;
4) The five functional modules of geometric analysis, roughness analysis, structural analysis, frequency analysis, and functional analysis are complete;
5) One click analysis, multi file analysis, free combination of analysis items saved as analysis templates, batch sample one click analysis, and providing data analysis and statistical chart functions;
6)Up to 300 types of 2D and 3D parameters can be measured according to standards such as ISO/ASME/EUR/GBT.
3Precision control handle
The joystick with integrated displacement adjustment functions in X, Y, and Z directions can quickly complete pre measurement tasks such as stage translation, Z-direction focusing, and stripe finding.
4Dual channel air flotation vibration isolation system
The dual channel air flotation isolation system can be connected to a stable gas source at the customer's site or directly pressurized and inflated using a portable pressurization device, and can operate stably without an external gas source.
Appendix 1. 2D and 3D parameter tables calculated according to domestic and foreign standards such as ISO/ASME/EUR/GBT:
2D parameter table
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standard name |
parameter |
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ISO 4287-1997 |
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Main Section |
roughness |
Waviness |
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Amplitude parameter |
Pp, Pv ,Pz, Pc, Pt,Pa,Pq,Psk,Pku |
Rp, Rv ,Rz, Rc, Rt,Ra,Rq,Rsk,Rku |
Wp, Wv ,Wz, Wc, Wt,Wa,Wq,Wsk,Wku |
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spacing parameter |
PSm,Pdq |
RSm,Rdq |
WSm,Wdq |
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Material ratio parameter |
Pmr,Pdc |
Rmr,Rdc,Rmr(Rz/4) |
Wmr,Wdc,Wmr(Wz/4) |
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Peak parameter |
PPc |
RPc |
WPc |
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ISO 13565 |
ISO 13565-2 |
Rk,Rpk,Rvk,Mr1,Mr2,A1,A2,Rpk,Rvk |
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ISO 12085 |
Roughness graphic parameters |
R,AR,R× , Nr |
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Ripple Shape Parameters |
W,AW,W×, Wte |
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Other graphic parameters |
Rke,Rpke,Rvke |
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AMSE B46.1 |
2D parameters |
Rt,Rp,Rv,Rz,Rpm,Rma×, Ra,Rq,Rsk,Rku,tp,Htp,Pc,Rda,Rdq,RSm,Wt |
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DIN EN ISO 4287-2010 |
Original contour parameters |
Pa,Pq,Pp,Pv,Pz,Pc,Pt,PSk,PKu,PSm,PPc,Pdq,Pdc,Pmr, |
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roughness parameter |
Ra,Rq,Rp,Rv,Rz,Rc,Rt,RSk,RKu,RSm,RPc,Rdq,Rdc,Rmr, |
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Ripple parameter |
Wa,Wq,Wp,Wv,Wz,Wc,Wt,WSk,WKu,WSm,WPc,Wdq,Wdc,Wmr |
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JIS B0601-2013 |
Original contour parameters |
Pa,Pq,Pp,Pv,Pz,Pc,Pt,PSk,PKu,PSm,PPc,Pdq,Pdc,Pmr, |
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roughness parameter |
Ra,Rq,Rp,Rv,Rz,Rc,Rt,RSk,RKu,RSm,Rdq,Rdc,Rmr |
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Ripple parameter |
Wa,Wq,Wp,Wv,Wz,Wc,Wt,WSk,WKu,WSm,WPc,Wdq,Wdc,Wmr |
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GBT 3505-2009 |
Original contour parameters |
Pa,Pq,Pp,Pv,Pz,Pc,Pt,PSk,PKu,PSm,PPc,Pdq,Pdc,Pmr, |
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roughness parameter |
Ra,Rq,Rp,Rv,Rz,Rc,Rt,RSk,RKu,RSm,Rdq,Rdc,Rmr |
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Ripple parameter |
Wa,Wq,Wp,Wv,Wz,Wc,Wt,WSk,WKu,WSm,WPc,Wdq,Wdc,Wmr |
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3D parameter table
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standard name |
parameter |
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ISO 25178 |
Height parameter |
Sq,Ssk,Sku,Sp,Sv,Sz,Sa |
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Function Parameters |
Smr,Smc,S×p |
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Spatial parameters |
Sal,Str,Std |
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Composite parameters |
Sdq,Sdr |
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Volume parameters |
Vm,Vv,Vmp,Vmc,Vvc,Vvv |
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morphological parameters |
Spd,Spc,S10z,S5p,S5v,Sda,Sha,Sdv,Shv |
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Function Parameter |
Sk,Spk,Svk,Smr1,Smr2,Spq,Svq,Smq |
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ISO 12781 |
Flatness parameter |
FLTt,FLTp,FLTv,FLTq |
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EUR 15178N |
Amplitude parameter |
Sa,Sq,Sz,Ssk,Sku,Sp,Sv,St |
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Spatial parameters |
Str,Std,Sal |
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Composite parameters |
Sdq,Sds,Ssc,Sdr,Sfd |
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Area and volume parameters |
Smr,Sdc |
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Function Parameters |
Sk,Spk,Svk,Sr1,Sr2,Spq,Svq,Smq |
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Functional indicator parameters |
Sbi,Sci,Svi |
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EUR 16145 EN |
Amplitude parameter |
Sa,Sq,Sy,Sz,Ssk,Sku |
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Mix Parameters |
Ssc,Sdq,Sdr |
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Functional indicators |
Sbi,Sci,Svi,Sk,Spk,Svk |
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Spatial parameters |
Sds,Std,Stdi,Srw,Srwi |
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Hardness parameters |
Hs,Hvol,Hv,Hps,Hpvol,Hpv,Hap,Hbp |
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ASME B46.1 |
3D parameters |
St,Sp,Sv,Sq,Sa,Ssk,Sku,SWt |