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E-mail
tangyy2010@126.com
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Phone
15221841067
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Address
Building 2, No. 26 Leshan Road, Xinbei District, Changzhou City
Shanghai Danshun Industrial Co., Ltd
tangyy2010@126.com
15221841067
Building 2, No. 26 Leshan Road, Xinbei District, Changzhou City
MES connection oven PI glue curing furnace 375 degree PI glue oxygen free box
375 degree PI adhesive without oxygenovenmainly doBPO adhesive/PI adhesive/BCB adhesive curing, IC (wafer CMOS、Bumping、TSV、MENS、 Fingerprint recognition) FPD、 High precision electronic components and electronic ceramic materials undergo dust-free drying, while electrical products, materials, and spare parts undergo drying and aging tests in high-temperature, clean, and oxygen free environments.
375 degree PI adhesive without oxygenovenMain technical indicators
1. Cleanliness level: Class100
2. Oxygen content:<=20PPM
3. Operating temperature: RT~400 ℃, maximum temperature: 450 ℃;
4. Number of cavities: 2, arranged vertically; Independent temperature control
5. Furnace material: SUS304 mirror stainless steel; Heating element: stainless steel heater; thermocouple
6. Empty furnace heating time: 1.5 hours;
7.Empty furnace cooling time:375℃--80℃; Cooling time is 1.5-3.5 hours (using water cooling and air cooling);
8.Intelligent control system: Omron from JapanPCL+PC industrial control computer
Characteristics of intelligent control system:
◆ Can be accessedMES andERPcommunication
◆ Hierarchical management of permissions, providing each manager, engineer, and operator with an independent username and password
◆ intelligent control systemQuery historical data, operations, alarms, events, and other data, memorize operation steps, and operate conveniently
◆ Internal data recording on PC can be accessed using commonly used software such as Excel, with a minimum data recording interval of 5 seconds;
Process line standards
1. Heat up at a rate of 3-5 ℃/min for 40 minutes to 200 ℃ at room temperature
2. Maintain a constant temperature of 200 ℃ for 45 minutes
3. Raise to 375 ℃ in another 40 minutes
4. 375 ℃ constant temperature for 1 hour
5. Finally, at a cooling rate of 3-5 ℃ per minute, the temperature drops from 375 ℃ to 75 ℃ in about 79 minutes
Company Name: Shanghai Danshun Industrial Co., Ltd
MES connection oven PI glue curing furnace 375 degree PI glue oxygen free box