IC packaging measurement

IC packaging measurement

The measurement of backend processes is crucial for controlling the final quality of IC packaging. When welding equipment, IC packaging issues may cause connection problems, resulting in wire breakage, protrusions on chip contact points, and increased stress on IC circuits. For these reasons, it is not only important to control the geometric shape of the mold, but also to control the flatness of the fixed area of the mold, the height of the steps between the mold and the attachment points on the package, and the roughness of the solder wire attachment area.

metering

Flatness
Matching the flatness of the mold with the flatness of the fixed area of the mold is crucial for reducing the stress on the IC during the packaging process and the entire operation of the device. In addition, to ensure correct IC layout and good electrical contacts during soldering, it is also necessary to control the flatness of the entire package.

Roughness
In order to ensure good adhesion performance when attaching the mold, it is necessary to control the surface roughness of the fixed area of the mold. In addition, the roughness of the solder wire attachment area is also very important for achieving good conductivity and good wiring stability.

Step height
The step height of IC packaging has various applications. From measuring balls, protrusions, and wires to measuring the geometric structure of the package itself, including the depth of the mold fixing area.