Glue pre firing integrated furnace

Glue pre firing integrated furnaceProduct Features:

Reasonable structure: The furnace is built with high-quality Morgan TJM refractory bricks, which have a longer service life and higher furnace cleanliness. The furnace mouth and door are independently developed, with low maintenance costs and fast replacement. Special design of insulation layer, significantly reducing surface temperature rise to avoid burns and save energy

Uniform temperature control: Three temperature zones with dual preheating thermal field control method: switching between high and low temperature hot air circulation to ensure the uniformity of temperature field for low-temperature rubber extrusion and high-temperature sintering. The temperature measuring element is selected as a national standard Class I precision thermocouple.

Simple operation: The operating system standard is a manual program control system. It can also be upgraded to a touch screen integrated control system, making it convenient for long-term repetitive work. Two systems have: automatic opening and closing of the glue discharge port through a set program, and automatic switching between low-temperature glue discharge and high-temperature pre sintering stages.

Safe to use: The pressure detector can set and detect the pressure inside the furnace. When the pressure inside the detection furnace exceeds the set pressure, the rubber discharge port will automatically open. At the same time, the electric furnace also has functions such as opening the door to cut off power and over temperature protection

Technical parameters of adhesive pre firing integrated furnace:

The adhesive pre firing integrated furnace is suitable for the degreasing, pre firing, and sintering integrated heat treatment process of precision electronic ceramic components such as dielectric ceramic filters, low-temperature co fired ceramic LTCC, ceramic capacitors MLCC, ceramic circuit boards, optoelectronic communication ceramic chips, and atomization sensors. It is used for precision adhesive firing of aluminum nitride substrates, silicon nitride substrates, nitride ceramics, and oxide ceramics.
It can also be used for degreasing and sintering processes of ceramic functional and appearance parts in the 3C field, such as mobile phone backplates, watch cases, piezoelectric ceramics, oxygen sensors, etc., as well as for pre sintering and bonding of semiconductor ceramic devices, 3D printed ceramics, optical ceramics, magnetic ceramics, etc. The equipment has the advantages of stable temperature control, low energy consumption, and clean furnace, making it suitable for mass production and scientific research in universities, research institutes, and enterprises.