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Phone
13806216898
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Address
No. 66 Tonghe Road, Weiting Town, Suzhou Industrial Park
Product Categories
Suzhou Tianhong Laser Co., Ltd
Fully automatic wafer splitting machine
NegotiableUpdate on 01/31
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Overview
This equipment is mainly developed as an automatic wafer splitting device for GPP wafers; Equipped with automatic loading and unloading, Z-axis pressure sensing, visual angle correction, dual piece detection, and automatic liquid spraying function.
Product Details
Product features:
This equipment is mainly developed as an automatic wafer splitting device for GPP wafers; Equipped with automatic loading and unloading, Z-axis pressure sensing, visual angle correction, dual piece detection, and automatic liquid spraying function;
The equipment has high mechanical yield and fast fragmentation efficiency;
Full Chinese operation interface, intuitive and easy to operate, with a good interface;
Process parameters can be stored and retrieved, making operation easy;
Pressure numerical sensing, can be displayed in a curve chart;
Automatic drainage system.
Specification parameters:
| technical specifications | Wafer slicer |
| Processing speed | 100-120pcs/H |
| Application Fields | After semi cutting and slicing the wafer, it splits into scattered particles |
| Loading and unloading methods | Fully automatic module |
| control mode | software |
| pressure control | ±2.5N |
| Correction method | CCD |
| Correction accuracy | ±0.4° |
| YIELD | ≥99.5% |
| Shard roller hardness | ≤90HRC |
| cushion thickness | ≥5mm |
| Cutting speed | 250mm/s-300mm/s |
| cutting depth | ≤120um |
| Alignment method | template matching |
| Visual Processing | Binarization processing |
| X/Y axis movement range | 140mm |
| θ axis | 270deg |
| Platform levelness | 5-15um |
| laser device | Ruike 30W/IPG20, 30W |
