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Shenzhen Shengshi Chenhui Technology Co., Ltd
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Shenzhen Shengshi Chenhui Technology Co., Ltd

  • E-mail

    chenhui6688@126.com

  • Phone

    13418554515

  • Address

    Building G and H, Block A, Dongsheng Science and Technology Park, No. 39 Dongfang 1st Road, Songgang Town, Bao'an District, Shenzhen City, Guangdong Province

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Fully automatic flipping spray glue curing machine

NegotiableUpdate on 08/20
Model
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Product Category
Place of Origin

Overview

Working characteristics of fully automatic flipping spray glue curing machine: 1. No need for manual labor, 360 ° automatic flipping, and can be glued and cured at any angle on both sides

Product Details

Fully automatic flipping spray glue curing machine

Job characteristics:
1. No need for manual labor, 360 ° automatic flipping, adhesive curing at any angle on both sides;
2. It has functions such as drawing points, lines, arcs, circles, inputting programs for irregular curves with continuous gaps, and can be used for 3D dispensing;
3. Continuous dispensing function for irregular curves such as points, lines, surfaces, and arcs;
4. Speed, low noise speed, DC brushless motor ensures good dispensing;
5. Static eliminators can eliminate static electricity within ± 100V;
6. The automatic compensation function for dispensing force makes the operation more convenient;
7. XY area array, translation and rotation calculation function, reverse material tray, suitable for positioning of different jobs;
8. Support four axis spatial linear interpolation, four axis spatial arc interpolation, and elliptical arc interpolation;

Product specifications:

name
Fully automatic flipping spray glue curing machine
model
SSCH-331F
itinerary
300*300*100mm
Maximum load on the countertop 10KG
Z-axis maximum load
5KG
movement speed
X/Y axis 1-600/s
repeatability
±0.02mm
Transmission method
linear guide
Edit Mode
Teaching box or file import
input voltage AC 220V 50/60Hz
Ambient Temperature
5-50°
Working environment humidity
20-90%
Temperature control range
0-80°
Total weight
70KG
Light source size
260*120mm
curing time
8-15s
Curing area
220*8mm
Total power
300W
Overall dimensions
L680*W630*H760mm
Application industry:
Electronic Engineering
PCB board, SMTLCD components, objects;
D LED manufacturing
Filling and sealing glue, LED soft strip packaging
telecommunications industry
UV gluehot melt adhesive
Optical communication industry
Silicone, optical adhesive micro dispensing, packaging, etc

Process application:
The bonding, infusion, mounting, coating, sealing, filling, dripping, reinforcement, line/arc/circular gluing, etc. in the product process.