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Shenzhen Yunteng Laser Technology Co., Ltd
FPC cover film laser cutting machine
NegotiableUpdate on 02/08
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Overview
FPC cover film laser cutting machine
Product Details
Welcome to personalized customization
A professional customization team can provide personalized customization services according to the needs of customers. If you have such needs, please feel free to consult the customer service hotline: 13751030658.
Welcome to free sampling
Yunteng Laser can provide free sampling services. For technical consultation, process consultation, product consultation, and transportation consultation, please call directly!
Welcome to visit in person
Yunteng Laser's product quality is industry-leading. Welcome to visit and inspect the company on site! Multiple companies designated laser brands and witnessed together.
This device is mainly designed for materials such as FPC, PCB, ceramics, etc. It uses high-power ultraviolet lasers to achieve fast and precise cutting and drilling, and has a wide range of applications
Pan.Application areas: FPC, PCB, soft hard bonding board cutting, fingerprint chip module cutting, soft ceramic cutting, cover film window opening.
FPC cover film laser cutting machine application industry
Fingerprint recognition chip cutting; FPC soft board cutting and drilling; PCB circuit board slicing and cutting.
Characteristics of FPC Cover Film Laser Cutting Machine
Using globally advanced lasers and core components, with good beam quality and high power stability;
Years of process tuning and optimization, focusing on spot quality, good cutting effect, and high efficiency;
The equipment is equipped with an optical marble platform, a high-speed and high-precision linear motor, and a negative pressure adsorption system for precise positioning and high processing stability;
There are two different models of loading and unloading: manual loading and unloading and automatic loading and unloading, which can be customized according to customer needs
Advantages of FPC Cover Film Laser Cutting Machine
Using nanosecond ultraviolet laser and cold light source, the laser cutting heat affected zone is particularly small as 10 μ m;
The minimum focused spot can reach 10 μ m, suitable for micro cutting and drilling of any organic and inorganic material;
CCD visual pre scanning&automatic target positioning, maximum processing range of 500mm × 450mm, meeting 99% PCB material processing, XY platform splicing accuracy of ≤± 3 μ m;
Support multiple visual positioning features, such as crosses, solid circles, hollow circles, L-shaped right angled edges, image feature points, etc;
The robot automatically loads and unloads materials, cuts IC fingerprint recognition chips, and takes 3 seconds per chip;
6 years of research and design technology accumulation in laser microfabrication systems, stable performance, and no consumables;
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