External semiconductor chip intelligent vacuum packaging machine

External semiconductor chip intelligent vacuum packaging machine

External vacuum packaging machine for semiconductor chipsIt is to place the material outside for vacuum sealing, which can automatically extract the air inside the packaging bag, complete the sealing process after reaching the predetermined vacuum degree, or fill it with nitrogen or other mixed gases, and then complete the sealing process. Suitable for vacuum packaging of fabrics, cotton and wool products to compress packaging volume and save logistics costs. Vacuum packaging of seafood, fruits, tea, salted items, soy products, etc. to prevent oxidation and spoilage, and extend shelf life. Vacuum packaging of electronic products (semiconductors, circuit boards, electronic finished products, etc.) and metal processing parts to prevent moisture, oxidation, discoloration, and static electricity.

Features of External Vacuum Packaging Machine for Semiconductor Chips:

The working process is automatically controlled by a computer board, and the entire process is displayed on a digital tube. The heat sealing temperature, vacuum degree of item packaging, and nozzle extension time can be freely adjusted;

The entire body is made of high-temperature baking paint, stainless steel control panel, Omron solid-state relay control circuit, cylinder and solenoid valve, and environmentally friendly vacuum pump;

The external vacuum packaging machine has the advantages of compact structure, small volume, light weight, low power consumption, high sensitivity, and easy operation and maintenance;

This external vacuum packaging machine is suitable for packaging materials such as various composite films such as polyester/polyethylene, nylon/polypropylene, polypropylene/polyethylene, polyester/aluminum foil/polyethylene, etc;

This external vacuum packaging machine is not limited by the size and volume of the packaging material, and can be used for vacuum or nitrogen (or other gas) packaging at will;

◆ Wide adaptability, high economic benefits, and very convenient to use;

The bottom is equipped with casters that can move freely.

Parameters of external semiconductor chip vacuum packaging machine:

Product Name/Specification ZH-ZKJ-600

Packaging capacity (packaging) 3-10

Sealing size 600 * W5~10

The packaging size is not limited to x W600 x H

Power supply 220V/380V 50Hz-60Hz

Total power 1.8KW

Vacuum degree 0.2KPa

Machine weight 80kg

Dimensions 670 × W460 × H1050

Purchase instructions:

1) The product images are for reference only, and the actual product specifications and dimensions shall prevail. Special requirements can be customized;

2) A large amount of inventory, online quotations are reference prices, and actual quotations shall prevail;

3) Affordable prices, we can guarantee that our products have a very high cost performance ratio;

4) Our company can provide free shipping service.

After-sales service

Regarding shipping: Regular products are available in stock and can be shipped within 72 hours. Special specifications and models require customization.

Regarding shipping costs: All products are shipped directly from the manufacturer, with free shipping.

Regarding delivery: Generally, logistics take 3-7 days to arrive, and you can choose to pick up the goods yourself or have them delivered to your doorstep.

Regarding after-sales service: All products come with a one-year warranty, lifetime technical after-sales service, and lifetime maintenance.

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External semiconductor chip intelligent vacuum packaging machine