Desktop Lithography Machine _ Encyclopedia _ Jiangsu Leibo supplies Hangzhou/Shanghai and other places

Desktop lithography machine parameters: 1. Maximum exposure area: 160mm * 160mm. ⒉. Exposure resolution: 1um (positive adhesive with a thickness ≤ 0.5um). 3. Alignment accuracy:; 1um (standard wafer polishing pad). 4. Light source intensity: 35mW/cm2. 5. Exposure wavelength: LED light source (imported LED chips, lifespan>10000 hours)

　　Desktop lithography machineparameter

1. Maximum exposure area: 160mm * 160mm

⒉. Exposure resolution: 1 μ m (positive adhesive with a thickness ≤ 0.5um)

3. Alignment accuracy: ± 1um (standard wafer polishing pad)

4. Light source intensity: 35mW/cm2

5. Exposure wavelength: LED light source (imported light beads, lifespan>10000 hours)

6. Exposure method: timed (countdown method)

7. Relative motion range of mask sample: X: better than ± 5mm;

8. Y: better than ± 5mm; 0: better than ± 6 °

9. Mask size: 7 inches, sample size: 6 inches (wafer)

10. Digital setting alignment gap and exposure gap

11. Mask sample separation gap: 6=O-500um, continuously adjustable

12. Alignment method: Automatic alignment, can add types of alignment marks according to customer needs, with a total of no more than 4 sets

13. Automatic film transfer: Automated film transfer by robotic arm (with dedicated sample robotic arm and fork), including pre alignment and positioning function

14. Microscopic scanning range: Y: ± 40mm (digital setting)

15. It has four functions: positive pressure air floating exposure, hard contact exposure, pressure contact exposure, and proximity exposure. CCD+telecentric lens+display alignment, optical imaging

16. Leveling contact pressure ensures repeatability through sensors

17. Dual objective adjustable distance range: 30mm-130mm