Connection structure of edge banding machine

Technical Parameter

configuration table

1. The polishing device uses a cotton polishing wheel to clean the processed board and polish it to make the edge face smoother.
2. The adhesive edge sealing device uses a special mechanism to evenly apply adhesive to the edge sealing plate and material, ensuring a stronger bonding force.
3. The head alignment device moves through a precise linear guide, and adopts mechanisms such as automatic tracking of the model and rapid cutting of high-frequency electrodes to ensure a smooth and flat cutting surface.
4. The edge scraping device is used to eliminate the ripple marks caused by the cutting process of non-linear edge trimming, making the upper and lower parts of the edge material smoother and neater.