Come on! LCPLN50XIR and 100XIR infrared objective lenses

Come on! LCPLN50XIR and 100XIR infrared objective lenses

Come on! LCPLN50XIR and 100XIR infrared objective lenses

Olympus infrared objective lens

5X/10X/20X/50XIR infrared objective lens

Used for industrial purposes

Metallurgy, semiconductor, aviation and other fields

Olympus LCPLN50XIR and LCPLN100XIR are microscope objectives designed specifically for near-infrared (NIR) spectroscopic observation, mainly used in semiconductor, electronic manufacturing, and industrial metallurgy fields for non-destructive testing of materials such as silicon wafer internal structures and IC chips. ‌34

‌1、 Core Technology and Design Features‌

00001. ‌Near infrared observation capabilityBoth objective lenses are optimized for near-infrared light with wavelengths of 700-1300nm, with high transmittance that can penetrate materials such as silicon, enabling non-destructive observation of the internal structure, bonding lines, or defects of the wafer. ‌38

00002. ‌Adjustable calibration ringThis is the core feature of the LCPLN-IR series. The objective lens is equipped with a correction ring, which can perform aberration correction for different thicknesses of covering materials (such as glass cover sheets or silicon layers), thereby maintaining high resolution and high contrast when observing different samples. ‌34

· ‌Glass thickness correction range‌： 0 - 1.2mm（50X）； 0 - 0.7mm（100X）。 ‌34

· ‌Silicon thickness correction range‌： 0 - 1.2mm（50X）； 0 - 1.0mm（100X）。 ‌34

00003. ‌Infinite optical systemAdopting an infinite distance correction optical design, compatible with standard infinite distance microscope optical paths. ‌12

00004. ‌Comparison of main optical parameters‌

‌2、 Application advantages‌

00001. ‌Improve detection accuracyHigh numerical aperture combined with aberration correction function can provide high resolution and image contrast in the near-infrared band, clearly revealing the microscopic details inside the material. ‌89

00002. ‌Enhance adaptabilityThe calibration ring design enables the same objective lens to adapt to wafers with different process flows or samples with different thickness packaging layers, without the need to replace the objective lens to obtain clear images, improving detection efficiency and flexibility. ‌38

00003. ‌Support imaging modeBoth objective lenses support bright field reflection and transmission observation, as well as polarized light observation. ‌210

00004. ‌System CompatibilityAs part of the Olympus UIS2 optical system, it can be used in conjunction with corresponding microscope bodies and accessories to build a professional near-infrared detection platform. ‌4

‌3、 Typical application scenarios‌

· ‌Semiconductor Failure AnalysisDetect cracks, voids, delamination, and metal wire connection defects inside integrated circuit chips. ‌8

· ‌Wafer inspectionObserve the doped regions, defects, and crystal structure inside the silicon wafer. ‌39

· ‌Materials Science ResearchUsed in various scientific research and industrial inspection fields that require internal imaging through opaque materials. ‌12