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Address
1st Floor, Building 11, Zhongguancun Software Park, Haidian District, Beijing
Beijing Madison Technology Co., Ltd
1st Floor, Building 11, Zhongguancun Software Park, Haidian District, Beijing
Beijing Madison USB3.0E data transmission feedthrough
Product features
Integrating the 5 Gbps ultra high speed data transmission capability of USB 3.0 with vacuum sealing technology.
Multi layer metal epoxy resin composite sealing technology.
Non magnetic materials.
High speed data transmission can reach 450MB/s.
Product parameters
Madison USB3.0E data transmission feedthroughSpecifications | |
housing material |
316L SS |
ultimate vacuum |
<1×10-9mbar |
sealing material |
Vacuum epoxy resin |
rated voltage |
30V DC |
rated current |
1.5A/pin |
Vacuum leakage rate |
<1×10-12Pa·m3/s He |
Operating Temperature |
-20℃~110℃ |
connection type |
Both the vacuum and atmospheric sides are female heads |
Product dimensions

Madison USB3.0E data transmission feedthroughCF flange selection table | ||
flange |
Number of feedthrough connections |
model |
CF25 |
1 |
MT174-USB3.0E-FF-C25 |
CF40 |
1 |
MT174-USB3.0E-FF-C40 |
CF63 |
2 |
MT174-USB3.0E-FF-C63-2 |
KF flange selection table | ||
flange |
Number of feedthrough connections |
model |
KF25 |
1 |
MT174-USB3.0E-FF-K25 |
KF40 |
1 |
MT174-USB3.0E-FF-K40 |
USB3.0Data transmission feedthroughRelated accessories | |
Vacuum cable |
USB 3.0 vacuum cable |