BPSS337H digital atmospheric pressure sensor

Product Introduction: BPS33H7H is a new generation high-performance digital output atmospheric pressure sensor developed by Bichuang Technology. The chip has high reliability, small size, low power consumption, and I2C interface output, making it particularly suitable for mobile terminal devices such as smartphones PAD、 Sports watches, navigation devices, etc. Contact us for information download

BPS37H is a new generation high-performance digital output atmospheric pressure sensor developed by Bichuang Technology. The chip has high reliability, small size, low power consumption, and I2C interface output, making it particularly suitable for mobile terminal devices such as smartphones PAD、 Sports watches, navigation devices, etc. The noise level of this device is as low as ± 1.4Pa (with a height variation of 11cm). BPS37H integrates a piezoresistive pressure element and a high-precision, low-power signal conditioning integrated circuit chip. The pressure element uses the optimized all silicon structure process of Bichuang Technology, which can provide relatively high accuracy for such a small pressure sensor; The signal conditioning integrated circuit can perform low-noise amplification and 24 bit precision analog-to-digital conversion. The built-in high linearity temperature sensor can output temperature signals, and the internal digital signal processing circuit can perform temperature digital compensation on the sensor. Each sensor undergoes a wide range of high and low temperature compensation calibration before leaving the factory, thereby achieving high-precision pressure information detection without considering temperature effects.
BPS33H7H adopts Beetech's BOWP (Beetech Opened Window Packaging) open packaging technology, which is based on the special requirements of pressure chip packaging. This technology has a window on the plastic packaging shell to ensure that the measured pressure is transmitted to the sensitive components, while protecting the gold wire. The reliability is very high, waterproof and dustproof, and it also reduces the packaging size of the chip. One molding simplifies the later packaging process, reduces costs, and opens up a new situation for large-scale and widespread applications. The device has a size of 3.6x3.8mm and a thickness of only 0.76mm, making it easy to place in compact mobile terminal devices.
Advantages:
BOWP open packaging process, waterproof and dustproof;
Factory temperature range -20-+60 ℃ temperature compensation calibration;
Small size, with a thickness of only 0.76mm;
Excellent cost-effectiveness.

Typical applications:
Measurement of air pressure and altitude on mobile devices such as smartphones and PADs
Indoor and outdoor navigation devices assist in navigation
Sports watch
Meteorological station
Aircraft