Traditional glue homogenizers usually only have a fixed dropper or static nozzle, which covers the photoresist on the substrate through central dropper or static spray, and then spreads the gel evenly through centrifugal force generated by high-speed rotation.

The four nozzle ultrasonic glue homogenizer is a revolutionary design. It integrates the following core components:

1. Four independent ultrasonic piezoelectric nozzles: this is the origin of their name. Each nozzle is an independent and precise liquid distribution unit.

2. High precision robotic arm: These four nozzles are installed on a multi degree of freedom robotic arm, which can accurately control the nozzles to perform complex three-dimensional movements above the substrate.

3. Ultrasonic atomization technology: using high-frequency ultrasonic vibration to "tear" the liquid into extremely small and uniform mist droplets (usually with a diameter of micrometers), and then spraying them out through a carrier gas.

4. Collaborative control system: a complex software system that can synchronously control the switch, flow rate, and motion trajectory of each nozzle and robotic arm.

Working principle description:
It is not simply dropping glue in the center, but rather like a "3D printer" or "inkjet printer", it controls four nozzles through a program to scan and spray on the surface of the substrate according to a preset path. Each nozzle can work independently or collaboratively, achieving coating uniformity and flexibility that Qian has never seen before.

2、 Core advantages

Compared with traditional glue homogenizers, the four nozzle ultrasonic glue homogenizer has overwhelming advantages:

1. High uniformity:

• By scanning spray coating, the "comet tail" or edge accumulation effect caused by uneven surface tension and initial distribution of traditional droppers can be eliminated.

• The droplet size generated by ultrasound is uniform, further ensuring the uniformity of film formation.

2. Step coverage and shape preservation of Zuyue:

• This is one of its most prominent advantages. For substrates with concave convex structures on the surface (such as MEMS devices and grooves on chips), traditional spin coating cannot effectively cover the sidewalls and bottom with colloids.

• The four nozzle system can spray the structural sidewall from multiple directions by adjusting the spraying angle and path, achieving Wan Meide conformal coating.

3. High material utilization rate:

• Traditional spin coating will result in over 95% of the photoresist being ejected from the substrate, causing significant waste, especially for expensive functional materials such as OLED materials and specialty polymers, which are unacceptable.

• This technology is "on-demand spraying", where the material directly reaches the area that needs to be coated, with a utilization rate of over 90%, greatly saving costs.

4. Excellent compatibility and flexibility:

• Compatible with complex shapes: Not only can it handle circular silicon wafers, but it can also easily handle substrates with square, irregular, and even curved shapes.

• Compatible with multiple materials: not only can it spray traditional photoresist, but it can also handle special liquids with high viscosity, containing particles, or sensitive to shear forces.

• Programmable graphing: In theory, complex functions such as local coating and gradient thickness coating can be achieved without the need for subsequent photolithography steps.

5. Reduce defects:

• Avoiding defects caused by liquid impact and bubble formation. The mild atomization spraying process can significantly reduce defects such as pinholes in the film.

3、 Main application areas

Due to its unique technological advantages, the four nozzle ultrasonic glue homogenizer is mainly used in cutting-edge technology fields with high requirements for glue coating process:

1. Advanced semiconductor manufacturing:

• 3D NAND Flash: Uniform photoresist filling in high aspect ratio structures.

• TSV (Through Silicon Via) technology: to achieve insulation layer or photoresist coating on the inner wall of deep holes.

• Advanced packaging: Applying glue on complex structures such as bumps and rewiring layers.

2. MEMS (Micro Electro Mechanical Systems):

• MEMS devices typically have complex three-dimensional microstructures that traditional spin coating cannot handle, and this device is a key tool for implementing their photolithography process.

3. Compound semiconductors and power devices:

• Chips such as GaN and SiC may have substrates that are not standard circular and have steps on the surface, requiring conformal coating.

4. Photon devices and optical components:

• Coating functional thin films on non planar optical components such as microlens arrays and optical waveguides.

5. Display technology:

• During the manufacturing process of OLED microdisplays, QLEDs, etc., luminescent materials or other functional layers are sprayed onto non flat or structured substrates.

6. Research and Frontier Exploration:

• In laboratories of universities and research institutions, used for developing new materials, processes, and device structures