Circuit board X-ray inspection

EFPscan planar CT is designed to meet the requirements of defect detection for large-sized electronic modules and product quality control in the electronics industry. It solves the key scientific problem of three-dimensional layered imaging and achieves high-precision automatic non-destructive testing of welding quality for electronic module packaging, printed circuit boards, high-density packaging, etc. It will be applied to product identification and evaluation, destructive physical analysis (DPA), and product process quality identification of various electronic systems in aerospace, aviation, marine, land, strategic weapons, and other equipment. In the development and production process of weapons and equipment, it identifies defects caused by product design, process design, and material introduction, such as PCB hole breakage, pillow effect of solder joints, cracks, etc BGA device solder ball defects and structural damage can improve the quality and reliability level of electronic products, enhance product research and development design and manufacturing process level, and strengthen the ability to identify and analyze electronic product defects.