Micro nano 3D printing systemIt is an advanced additive manufacturing equipment that can achieve high-precision three-dimensional structure manufacturing at the micrometer or even nanometer scale, widely used in cutting-edge scientific research and high-tech manufacturing fields such as microelectronics, photonics, biomedical, microelectromechanical systems (MEMS), metamaterials, and nanodevices. This system breaks through the limitations of traditional machining techniques in complex structures, small sizes, and material diversity, achieving precision manufacturing from bottom to top.
It usually consists of a high stability optical platform, a precision motion control system (such as a piezoelectric ceramic displacement table), a laser light source, a real-time imaging monitoring module, and dedicated control software. Users can import CAD models and drive the system to construct complex 3D microstructures point by point or layer by layer after slicing, such as micro lens arrays, biomimetic scaffolds, microfluidic chips, photonic crystals, and micro robots.
Micro nano 3D printing systemUsage method:
1、 Digital Modeling: From Concept to 3D Data
Design software selection:
Use CAD software (such as SolidWorks, Fusion 360) or 3D scanners to obtain digital models. It is necessary to ensure the water tightness (no loopholes) and reasonable structure of the model to avoid printing failures caused by too many suspended parts.
Example: When designing microfluidic chips, it is necessary to precisely control the channel width (such as 50 μ m) and spacing (such as 50 μ m) to match the requirements of biological experiments.
File format conversion:
Export the model to common formats such as STL and OBJ for easy processing by slicing software. If high-precision printing is required, you can choose a format that supports sub micron precision (such as binary STL generated by specific software).
2、 Slice processing: Decompose 3D into 2D
Software parameter settings:
Use professional slicing software such as Cura, PrusaSlicer, and Mofang software to discretize the model into hundreds to tens of thousands of two-dimensional sections along the Z-axis.
Layer thickness: Control the height of each layer (such as in P μ SL technology where the layer thickness can be as low as 5 μ m), which directly affects printing accuracy and speed.
Fill density: Adjust according to demand (such as 10% -20% for ordinary structures and 100% for solid components).
Support structure: Automatically generate support for suspended parts (such as in micro nano metal 3D printing, 90 ° suspended structures do not require support, but complex models still require auxiliary support design).
Generate GCode file:
Slicing software converts parameters into device executable instruction code (GCode), which includes key information such as printing paths and material parameters.
Example: In P μ SL technology, GCode requires precise control of the exposure timing of the DMD chip and the scaling ratio of the projection objective lens.
3、 Printing Preparation: Environmental and Material Control
Equipment calibration
Hot bed leveling: Use A4 paper to test the distance between the nozzle and the platform to ensure that the first layer of printing is firmly attached (such as in FDM technology, the nozzle height needs to be accurate to the 0.1mm level).
Optical path calibration: For P μ SL or TPP devices, it is necessary to adjust the laser focus position or align the DMD chip to avoid structural misalignment caused by spot displacement.
Material loading:
Photosensitive resin: Pour into the resin tank to ensure a flat liquid level (in P μ SL technology, liquid level fluctuations need to be controlled within ± 10 μ m).
Metal powder/wire: For SLM or FDM equipment, the nozzle needs to be preheated to the melting point of the material (such as PLA at 220 ℃, metal powder needs to be at a higher temperature).
Example: The CERES micro nano metal 3D printing system adjusts the injection pressure of metal ion solution with an accuracy of<1mbar through a microfluidic pressure controller.
4、 Printing Execution: Building Micro Nano World Layer by Layer
Start printing:
Import the GCode file into the device and click the 'Print' button. The equipment stacks materials layer by layer based on sliced data:
P μ SL technology: LED emits ultraviolet light, generates a dynamic mask through DMD chip, and exposes the liquid resin to solidify and form.
TPP technology: Femtosecond laser focuses on the interior of photosensitive materials, triggering local polymerization through two-photon absorption to achieve nanometer level accuracy (such as printing 5 μ m feature size structures).
FDM technology: Hot melt nozzles extrude molten material along a path, which solidifies after cooling (suitable for rapid prototyping, but with lower accuracy).
Process monitoring:
Real time feedback: Some devices are equipped with cameras or sensors to monitor printing status (such as layer thickness deviation and remaining material).
Error warning: If a support structure failure or material shortage is detected, it will automatically pause and prompt the user to intervene.
5、 Post processing: from printed copies to functional components
clean:
UV curing model: Rinse uncured resin with alcohol (such as removing residual resin in the flow channel of microfluidic chips printed with P μ SL).
Metal components: Ultrasonic cleaning to remove support structures or powder residues (such as metal parts printed by SLM that require acid pickling and passivation).
Curing/Sintering:
Light cured resin: UV lamp secondary irradiation enhances hardness (such as transparent parts for DLP printing that need to be post cured to reduce yellowing).
Metal powder: High temperature sintering increases density (such as SLM printed titanium alloy parts that require heat treatment above 1200 ℃).
Surface Treatment
Polishing: Use sandpaper or power tools to remove layer patterns (for example, PLA models can be soaked in polishing solution to improve surface quality).
Coloring/Coating: Spray acrylic pigment or chemical coating (such as gold plating for micro/nano structures to enhance conductivity).