Recently, the website of the Ministry of Industry and Information Technology announced 15 industry standards for the electronics industry, covering various aspects such as automatic plastic packaging of integrated circuits, flexible printed circuit materials, backlight components for liquid crystal displays, piezoelectric and dielectric devices for frequency control and selection.

Among them, the standard "SJ/T 11740-2019" for integrated circuit automatic plastic packaging systems specifies the terminology and definitions, classification and composition, technical requirements, inspection methods, inspection rules, labeling, packaging, transportation, and storage of integrated circuit automatic plastic packaging systems. It can be applied to automatic packaging systems used in the plastic packaging process of integrated circuits, as well as plastic packaging of semiconductor discrete devices.