DC magnetron sputtering instrument is a laboratory equipment that effectively deposits thin films by constraining electrons with a magnetic field and enhancing plasma density. It is widely used in materials research, semiconductor coating and other fields. Introduce inert gas into the vacuum chamber, apply high DC voltage to form an electric field, and ionize the gas to produce plasma. An orthogonal magnetic field is set on the surface of the target material, which constrains the trajectory of electrons through Lorentz force, prolongs their path, increases the probability of collision with gas, and thus improves plasma density and sputtering efficiency. High energy ions bombard the surface of the target material, causing atoms to sputter and deposit onto the substrate to form a dense thin film. This process requires accurate control of heat to avoid sample burns.
Advantages: Simple structure, stable and low-cost DC power supply system, easy equipment maintenance. For good conductor targets such as metals, the sputtering rate is high and can meet the needs of industrial scale production. Its process is good, the parameters are easy to control, the process window is wide, and it has rich experience in mass production.
This equipment is used for preparing thin films of metals, semiconductors, oxides, etc. It requires regular maintenance of the vacuum system, power supply, and target material to ensure process stability and film quality.
structural composition
Vacuum system: composed of vacuum pump, vacuum chamber, etc., used to provide a vacuum environment and ensure that the sputtering process is carried out at low pressure.
DC power supply system: provides a constant negative voltage to the cathode target material, triggering glow discharge.
Gas supply system: including gas storage tanks, mass flow meters, etc., used to fill the vacuum chamber with an appropriate amount of working gas, such as argon.
Target and substrate installation system: The target is installed on the cathode, and the substrate is fixed on the sample stage near the anode. The sample stage is usually heated and rotated to improve the uniformity of the film.
Magnetic field system: Set orthogonal magnetic fields on the surface of the target material to constrain the motion trajectory of electrons and increase plasma density.
Application field
Decorative coating: used to prepare metal decorative film layers such as gold, silver, chromium, etc., such as watch cases, eyeglass frames, automotive accessories, etc.
Tool hard coating: It can deposit TiN, CrN and other hard metal nitride films, improving the wear resistance and service life of cutting tools and molds.
Microelectronic interconnects: used to prepare metal thin films such as aluminum and copper as interconnects in integrated circuits to achieve the transmission of circuit signals.
Solar cell back electrode: Metal back electrodes such as aluminum and silver can be prepared to improve the photoelectric conversion efficiency of solar cells.