thin film depositionIt is to deposit a layer of film on the main substrate material of the semiconductor. This layer of film can be made of various materials, such as insulating compound silicon dioxide, semiconductor polycrystalline silicon, metallic copper, etc.The equipment used for coating is called a thin film deposition equipment.

In terms of semiconductor chip manufacturing process, it is located in the preceding process.

Thin film preparation processAccording to their film-forming methods, they can be divided into two categories:Physical vapor deposition (PVD) and chemical vapor deposition (CVD),among whichThe proportion of CVD process equipment is higher.

Physical Vapor Deposition (PVD)Gasification of the material source surface and deposition on the substrate surface through low-pressure gas/plasma, including evaporation, sputtering, ion beam, etc;

Chemical Vapor Deposition (CVD)It refers to the process of depositing a solid film on the surface of a silicon wafer through a chemical reaction of gas mixture. Depending on the reaction conditions (pressure, precursor), it can be divided into atmospheric pressure CVD (APCVD), low-pressure CVD (LPCVD), plasma enhanced CVD (PECVD), high-density plasma CVD (HDPCVD), and atomic layer deposition (ALD).