Immersion ultrasonic microscope is a non-destructive testing device based on high-frequency ultrasound, which penetrates the interior of materials through a liquid coupling medium (usually water) to perform high-resolution imaging of defects. Used for detecting small defects inside materials (such as cracks, voids, delamination, inclusions, etc.), the detection accuracy can reach the micrometer level, and can identify small defects in complex structures such as semiconductors, electronic components, aerospace parts, etc.
High frequency ultrasonic waves are emitted through an ultrasonic transducer and coupled into the material through liquid, forming different reflected/refracted waves at the defect site. The intensity and direction of these waves are collected and analyzed to generate ultrasonic intensity images of the defect.
The immersion ultrasonic microscope uses water as the coupling medium and emits ultrasonic waves through a high-frequency ultrasonic transducer. The ultrasonic waves propagate through the material, and when they encounter internal defects or interfaces between different media, some of the energy is reflected back. The transducer receives the reflected ultrasonic waves and converts them into electrical signals. After software data processing, a two-dimensional C-scan image is constructed to achieve visual detection of the internal structure of the material.
Structural composition: mainly includes industrial computers, data acquisition and analysis software, ultrasonic transducers, industrial control computers, water circulation systems, stainless steel frame structures, and motion modules. Among them, the motion module is responsible for the focusing and scanning motion of the ultrasound transducer; The ultrasound transmission and acquisition module is responsible for the signal transmission and acquisition in the acoustic pathway; The industrial host is responsible for controlling the motion and acquisition process, and processing and displaying the collected echo data through image processing.
Product features: Compatible with multiple frequencies of ultrasound probes, with quantitative analysis function, able to visually display the position, shape, and size of internal defects of the tested part in the form of images, and perform defect size and area statistics, etc; The detection software is independently developed with a user-friendly interface and can be continuously upgraded according to customer needs.
Widely used in industries such as new energy, semiconductors, power electronics, thermal management materials, diamond composite materials, carbon fiber composite materials, etc. For example, in the semiconductor industry, it can be used to detect defects inside chip packaging, such as delamination, voids, etc; In the new energy industry, it can be used to detect structural defects inside lithium batteries.