With the rapid development of the electronics, electrical, and aerospace industries, the demand for high-temperature resistant and high-performance insulation materials is increasing day by day. Polyimide（PI, as a typical high-performance engineering polymer material, has excellent thermal stability, dielectric properties, and mechanical properties, and is known as one of the current comprehensive performance organic polymer materials. Due to the presence of a large number of rigid aromatic rings and imide groups in the molecular structure, PI can maintain stable physical and chemical properties at high temperatures, and is widely used in key fields such as flexible circuit boards, microelectronic packaging, insulation films, aerospace structural components, etc.