This product adopts quasi dynamic measurement method, which can simultaneously measure the Seebeck coefficient and resistivity of thin film materials, with a temperature measurement range of up to
80K~600K。

Hardware features
The dynamic method for measuring Seebeck coefficient avoids systematic errors in temperature difference measurement caused by static methods, resulting in more accurate measurements

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Using a bidirectional heating system, if there are test defects, they can be retested
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Seebeck coefficient and resistivity measurement do not share voltage probes to avoid the problem of micro thermocouple fracture failure
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The software is easy to operate and intelligent, allowing for manual and automatic modes