PI glue curing furnaceIt is a professional equipment used for high-temperature curing and baking of PI (polyimide), widely used in the microelectronics industry and other fields. Its core function is to achieve high-quality curing of PI adhesive through precise control of temperature, time, and environmental conditions.

　PI glue curing furnaceTechnical features:

High temperature curing ability:

The maximum temperature of the PI glue curing oven can reach 450 ℃ (some models can be customized), which can meet the needs of high-temperature curing of PI glue.

The temperature fluctuation is controlled within ± 1 ℃, and the temperature uniformity reaches ± 5% (on the 300 ℃ plateau), ensuring the stability and uniformity of the temperature during the curing process.

Precise temperature control system:

Adopting intelligent control systems, such as the Japanese U-Easy Control System (which can be networked and connected to MES and SECSGEM), to achieve highly accurate temperature control.

Temperature control instruments are mostly designed with touch screens, supporting multi segment and multi process temperature control. They can be pre programmed with 120 programs, each with up to 99 segments, for a total of 1200 historical data queries (data can be exported through a USB interface).

Stable environmental control:

The curing oven has good sealing performance inside, which can effectively isolate external dust, impurities, and gases.

The internal atmosphere can be adjusted as needed, such as by using inert gases (such as nitrogen) for protection, to further reduce the occurrence of adverse reactions such as oxidation.

The oxygen content index is strict, with high temperature oxygen content ≤ 20ppm+gas source oxygen content, and low temperature oxygen content ≤ 50ppm+gas source oxygen content.

Automation and intelligent operation:

Equipped with advanced control systems, it can achieve automated temperature control, time control, and atmosphere control.

Operators only need to set parameters through a simple interface, and the curing furnace can automatically complete the entire curing process, reducing human errors in operation.

The real-time monitoring function can record parameters such as temperature, time, and atmosphere during the curing process, providing data support for quality control and process optimization.