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About Us
Nanjing Zhilian Optical Technology Co., Ltd
Date: 2022-03-17Read: 0
Failure analysis is the diagnosis of the cause of electronic component failure. In the process of failure analysis, it is often necessary to use instruments, equipment, and chemical methods to confirm the failure mode, determine the cause of failure, study the failure mechanism, and propose improvement and prevention measures. The methods can be divided into destructive analysis, non-destructive analysis, physical analysis, chemical analysis, etc. When conducting microscopic morphology detection, especially when observing cross-sections or internal structures, a combination of ion milling and scanning electron microscopy is needed for failure analysis research.
The ion grinder is currently a widely used sample preparation tool, which can perform profile cutting at different angles, as well as surface polishing and cleaning treatment, to prepare SEM samples suitable for semiconductor fault analysis.
Ion grinder
TECHNOORG LINDA
1
scanning electron microscope
Phenom SEM
2
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Basic principle of ion grinder
Analysis ideas and methods for chip failure
Case Study Sharing 1
Prioritize identifying the location of failure
After locking the failure analysis location, it was decided to use an ion grinder for cutting
Cutting in ion grinder
Cut the sample and observe it under magnification
After zooming in, it was found that the fault location was asymmetric on both sides
After further magnification, it was found that the fault location was deformed and cracked due to compression, which was the main cause of the failure
Deformation and cracking location
Magnification factor: 20000x
Deformation and cracking location
Magnification factor: 40000x
Failure Analysis of IC Packaging Testing
Case Sharing 2
Cut the failure location
Cutting in ion grinder
Position 1: Upon zooming in, it was found that this area is not connected. Magnification factor: 30000x
Upon magnification, it was discovered that there was a crack at location 2. Magnification factor: 50000x
Failure Analysis of PCB/PCBA
Case Study 3
Ion grinder
SC-2100
Suitable for ion beam profile cutting and surface polishing
Can preset different cutting angles to prepare cross-sectional samples
Can be used for sample polishing or fine polishing and cleaning in the final stage
Ultra high energy ion gun for rapid polishing
Low energy ion gun is suitable for non-destructive fine polishing and cleaning of surfaces after post-treatment
Easy to operate, embedded computer system, fully automatic setting operation
Standardization of cooling system, applied to multiple types of samples
Real time monitoring of polishing process using high-resolution color camera