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Strength in every inch: ALD analysis of desktop atomic layer deposition coating system
Date: 2025-11-19Read: 0

There is an urgent demand for high-performance, cost-effective, and convenient equipment in the field of thin film preparation. This desktop atomic layer deposition coating system (ALD) precisely fits, with lower cost and simpler operation and maintenance, opening up new paths for the application of ALD technology.

Compact is its core advantage, occupying only 2.5 square feet of space, with a desktop design suitable for clean rooms and other scenarios. The streamlined small volume chamber achieves rapid circulation, greatly improves deposition efficiency, and supports batch sample processing and high-frequency experiments.
Accurate parameters for high-quality coating protection: chamber temperature at room temperature -325 ° C (± 1 ° C), precursor temperature at room temperature -150 ° C (± 2 ° C, with heating jacket added), source bottle heating can be selected up to 200 ° C; substrate heater (for chips) supports temperature control at room temperature -350 ° C. Three sets of precursor sources and dual nozzles have expanded the selection of coating materials.
Excellent core performance: 600W 13.56MHz RF power stability, maximum pressure ≤ 5.0 × 10 ⁻³ 乇, paired with dry pump/rotary vane pump to build a stable vacuum. The uniformity of thin film deposition is ≤± 3%, ensuring the consistency of the coating. Full hardware and software interlocking design ensures safe operation in multi-user environments.
Outstanding value in electron microscopy sample preparation: Electron microscopy samples require conductive films such as Pt and Pd to suppress charges and reduce thermal damage, and traditional PVD technology cannot meet the coating requirements of 3D samples. This ALD system is optimized for the growth of conductive metals in small samples, and can produce 3D conformal films and traditional 2D films, replacing sputtering/evaporation techniques, at a price comparable to desktop sputtering equipment.
Humanized system operation and maintenance: PC UPRO software achieves full control, simple maintenance, and compatibility with mainstream precursors. The compact size of 850mm × 720mm × 600mm can support workpieces up to 6 inches, achieving "small size, high energy".
With precise parameters, wide application, cost advantages, and convenient operation, this ALD system has become an ideal choice for thin film preparation, helping to popularize ALD technology.