In the field of micro nano manufacturing such as semiconductors and flexible electronics, the stress state of thin film materials directly determines the performance and lifespan of devicesIn situ thin film stress testerWith its characteristics of "real-time monitoring and ultra-high precision", it has become a core device for capturing stress changes at the micro and nano scales. It can accurately sense the stress fluctuations of nanoscale films throughout the entire process of film preparation and service, providing data support for solving problems such as device warping and cracking. It is a key tool for micro nano manufacturing to shift from "experience optimization" to "precise control".

1、 Technical Core: "Perceived Password" of Micro/Nano Stress

The precise capture capability of the tester comes from two core technologies. One is the optical interference measurement system, which uses the principle of laser interference to convert the small deformation of the substrate caused by thin film stress into displacement signals of interference fringes. Through algorithm analysis, it can achieve a stress resolution of 0.1 MPa level, and can accurately respond even if the thin film thickness is only a few nanometers. The second is in-situ adaptation design, which allows the equipment to be integrated into thin film preparation equipment such as sputtering and evaporation, and real-time data collection can be carried out in harsh process environments such as vacuum and high temperature, avoiding stress release errors caused by traditional offline detection and achieving "preparation detection" integration.

2、 Core advantage: Beyond traditional stress detection capabilities

Compared to traditional detection methods, the in-situ thin film stress tester exhibits three major advantages. Firstly, it has high time resolution and can capture millisecond level instantaneous stress changes, such as the stress initiation process in the early stage of thin film deposition, providing dynamic basis for optimizing film formation parameters. Secondly, accurate spatial positioning is achieved by focusing on specific areas through a microscopic optical system, enabling precise detection of local stresses in thin films and solving the limitations of traditional methods of "averaging" measurements. Thirdly, non-contact measurement and laser detection methods avoid damage to micro nano films caused by mechanical contact, especially suitable for detecting fragile polymer films in flexible electronics.

3、 Application scenario: The "quality guardian" of micro nano manufacturing

This device has become a tool for micro nano manufacturing in multiple fields. In semiconductor chip manufacturing, it is used to monitor the stress state of the metalized thin film on the wafer surface, in order to avoid chip cracking or circuit failure caused by stress concentration; In the field of flexible display, real-time control of the stress of OLED packaging film ensures the stability and lifespan of the device during bending. In the photovoltaic industry, optimizing the interlayer stress matching of thin film cells can improve the photoelectric conversion efficiency; In the aerospace field, detecting the stress distribution of spacecraft coating films to ensure their protective performance in harsh environments.

With the development of micro nano manufacturing technology towards "smaller and more precise",In situ thin film stress testerThe role is becoming increasingly prominent. It can not only accurately capture stress changes at the micro nano scale, but also achieve closed-loop optimization of process parameters through data feedback, increasing the qualification rate of thin film devices by more than 30%. As a "stress catcher" in the field of micro nano manufacturing, it provides solid technical support for the research and mass production of devices, promoting the high-quality development of China's micro nano manufacturing industry.