XPS (X-ray photoelectron spectroscopy), as a highly sensitive surface analysis technique, plays a key role in surface contamination and interface analysis of chips and PCB boards, as reflected in the following aspects:

Surface Pollution and Interface Analysis of Chips

Element and chemical state recognition: XPS can accurately identify all elements on the chip surface except for hydrogen (H) and helium (He), and determine the presence of elements through the position of characteristic spectral lines. For example, in the detection of oxidation or residual pollutants on the surface of silicon wafers, XPS can accurately determine the presence of impurities such as silicon oxide (SiO ₂), and analyze the photoelectron peak intensity to quantitatively determine the element content or relative concentration, providing key data support for optimizing processes and improving product quality.

Interface chemical state analysis: XPS can deeply analyze the surface characteristics of chip materials, including chemical composition, elemental valence states, and energy state distribution. This is crucial for understanding the impact of interface chemical states on device performance, for example, by measuring the electron cloud distribution and energy level structure of surface electrons, engineers can optimize the surface treatment process of devices, improve device performance and lifespan.

Surface Pollution and Interface Analysis of PCB Board

Coating quality analysis: XPS can inspect the composition, chemical state, and thickness distribution of PCB pad coatings, revealing the redox state of the coating metal, the chemical form of impurity elements, and reflecting the coating process and post-treatment level. This is crucial for identifying subtle surface defects, abnormal corrosion layers, and even pollutant deposits, which helps to enhance the scientific nature of product reliability assessment.

Pollution investigation and failure analysis: XPS can detect residual pollutants such as fluorine and carbon in the manufacturing process of PCB boards, and locate the abnormal distribution of elements at short-circuit/break points. For example, in the analysis of poor contact in the "golden finger", XPS can detect the oxide layer, pollutants, or residual organic matter on the surface of the contact point, thereby determining the cause of poor contact.