1Automatic glue mixing and developing machineWorking principle: Precise synergy of physical and chemical processes
The automatic uniform coating and developing machine completes the uniform coating, curing, and pattern development of photoresist in the photolithography process through three core steps: coating, heat treatment, and development. Its principle can be decomposed into the following steps:
Glue coating process
Dropping and spin coating: A high-precision pump drips a quantitative amount of photoresist to the center of the wafer, and the wafer is fixed by a vacuum suction cup and then rotated at high speed (speed 0-10000rpm, accuracy ± 1rpm), using centrifugal force to evenly spread the photoresist and form a nanoscale adhesive film. For example, the DYX-640S model from the 45th Institute of China Electronics Technology Group Corporation achieves a 4/6-inch wafer adhesive film thickness fluctuation of ≤ 3% through dynamic spin coating.
Edge cleaning: The edge photoresist removal function removes excess adhesive layer from the wafer edge to prevent subsequent process contamination. Some devices, such as Sanhe Jianhua High tech DYX-840S, support photoresist viscosity ≤ 1000Cp and are suitable for processing low viscosity materials.
heat treatment process
Pre bake: Bake at 80-120 ℃ to evaporate some solvents in the photoresist, reduce internal stress, and prevent film cracking. The hot plate adopts zone temperature control technology, with temperature uniformity of ± 0.5 ℃ (50-100 ℃).
Post bake: Bake after exposure (110-140 ℃) to reduce standing wave effects, promote chemical reactions, and improve pattern resolution.
Hard bake: After development, bake (150-180 ℃) to further solidify the photoresist and enhance its etching resistance.
Developing process
Developer spraying: The developer (such as TMAH) is evenly sprayed onto the surface of the wafer through a nozzle (cylindrical or H-shaped), and the development is rotated (100-500rpm) to cause a chemical reaction between the developer and the photoresist, dissolving the exposed or unexposed areas.
Rinse and spin dry: Clean the wafer with deionized water to remove residual developer, and then spin dry at high speed. The precision of the developer supply is ± 0.1ml, and the development time and temperature need to be precisely controlled to avoid over or under development.
IIAutomatic glue mixing and developing machineStructural features: Modular design drives flexibility and efficiency
The modular architecture of the automatic glue leveling and developing machine is its core innovation point, which achieves multi scene adaptation through the combination and expansion of independent functional units
Functional units operate independently
Gluing unit: equipped with high-precision dispensing device and dynamic rotating platform, supporting 100-6000rpm stepless speed regulation. For example, the Shanghai Maikewei P9006 equipment is equipped with two sets of uniform adhesive units, which can simultaneously process photoresist of different viscosities.
Developing unit: Integrated multi-directional spray system and liquid film monitoring sensor, with a developer distribution deviation controlled within 5% (6-inch wafer).
Heat treatment unit: includes 4 baking units and 3 cooling units, with a temperature control range covering room temperature to 250 ℃. It is heated using mica heating plates, with a temperature uniformity of ± 1 ℃ (50-120 ℃).
Scalability and compatibility
Wafer size adaptation: Supports processing of 2-12 inch wafers and increases production capacity by adding modules. For example, the DYX-640S model comes standard with 1 set of robotic arms, 2 sets of glue blending units, and 2 sets of developing units, with a daily processing capacity suitable for 4-inch and 6-inch wafer production lines.
Process compatibility: Supports g-line, i-line, and some KrF adhesive types to meet the requirements of 130nm process technology. Some devices (such as AC200-PP-CTM) provide 100 sets of programmable process steps and support personalized function customization (such as back washing and edge removal).
Environmental Control and Intelligence
Fully enclosed design: dry wet separation structure and electro-hydraulic separation design to prevent cross contamination. Optional laminar flow hood (FFU) to improve local cleanliness to Class 100 standard.
Automation control: Equipped with an industrial grade PLC control system, it stores over 200 sets of process parameter combinations and supports abnormal alarm mechanisms (32 types of equipment status monitoring points) and data traceability functions (electronic batch recording).
Robotic arm transmission: Imported multi joint dual arm robotic arms achieve high-precision transmission of wafers between units (positioning accuracy ± 0.1mm), reducing human errors.