In the semiconductor industry, precise and reliable soldering processes are crucial for ensuring the functionality and service life of electronic components. However, if there is a trace amount of oxygen present during high-temperature welding, it can cause oxidation of the components, thereby affecting the quality and integrity of the solder joints.

For the analysis of trace oxygen in high-temperature inert furnaces and reflow soldering furnaces in the semiconductor industry, Industrial Physics brings you customer use cases to explore how Systech Illinois, an expert in trace gas and oxygen analysis, collaborates with Sikama International to address the challenges of trace oxygen analysis in high-temperature inert furnaces and further optimize wafer bump processes.

Customer Profile:Sikama International

Sikama International is a manufacturer of advanced heat treatment equipment and solutions for the semiconductor industry. Sikama is headquartered in California, USA and is renowned for providing high-quality ovens and furnaces that meet various semiconductor process needs.

Sikama International's expertise lies in creating controlled environments without oxygen, as the presence of oxygen can have adverse effects on various materials and processes used in semiconductor manufacturing. By providing innovative solutions that ensure anaerobic environments, Sikama International enables its customers to achieve precise and reliable results during critical stages of semiconductor production.

Sikama's ovens are designed to meet the demanding requirements of the semiconductor industry, including applications such as wafer bumping, soldering, reflow soldering, and other thermal processes.

By collaborating with Systech Illinois experts, Sikama continuously seeks to optimize its equipment and processes. By integrating reliable trace oxygen analyzers, such as the EC913 oxygen analyzer provided by Systech Illinois, Sikama International ensures accurate monitoring and control of oxygen concentration within its inert furnace. This collaboration enables Sikama's customers to achieve solder joint quality, reduce defects related to oxidation, and improve overall production efficiency.

Case details:EC913 Trace Oxygen Analyzer

In the wafer bump stage, electronic components such as circuit boards and integrated circuits undergo a controlled heating process to melt solder, which has been previously applied through screen printing or separate placement of solder joints. Then, multiple circuit boards or ICs are interconnected during the subsequent process of passing through the oven. To ensure that there is no oxygen during this critical welding process, oxygen concentration samples need to be taken from three to six different areas inside the oven, depending on the model and size of the oven.

Due to the potential oxidation of compounds in solder, it is crucial to detect trace oxygen concentrations in the inert furnace environment. Oxidation can lead to insufficient solder joints, which cannot meet the requirements of conductivity and structural integrity. Therefore, timely resolution of this issue is crucial to prevent costly consequences such as component scrapping or rework.

Systech Illinois has provided Sikama International with a reliable and accurate EC913 trace oxygen analyzer. The EC913 oxygen analyzer is capable of measuring oxygen concentration from trace to percentage levels. By integrating this advanced analyzer into Sikama's inert melting furnace, oxygen content can be accurately monitored in the wafer bump process.

Through the Xishida EC913 trace oxygen analyzer, Sikama International can real-time monitor the oxygen concentration in each area of the furnace. Whenever a deviation from the required oxygen level is detected, this information enables them to take immediate corrective measures. By maintaining an oxygen free environment, Sikama ensures the formation of reliable and sturdy solder joints.

Case effectiveness:Improve the quality of solder joints and ..

The Systech Illinois EC913 trace oxygen analyzer under Industrial Physics has brought many benefits and advantages to Sikama International and its customers:

Firstly, improve the quality of solder joints:

By integrating the EC913 oxygen analyzer into their inert furnace, Sikama International achieved significant improvements in solder joint quality. Continuous monitoring of oxygen concentration can accurately control the oxygen free environment during the wafer bump process. This meticulous control prevents oxidation related issues and ensures reliable conductivity and structural integrity of the solder joints. The result greatly improved the overall reliability and performance of electronic components.

Secondly, reduce scrap and rework:

The real-time monitoring of oxygen levels enables Sikama to quickly identify and resolve any deviations from the required oxygen concentration range. By taking immediate corrective measures, such as adjusting furnace parameters or purifying the environment, Sikama effectively reduced the number of scrapped or reworked parts. The reduction of material waste has saved the company a lot of costs. In addition, the optimization of production processes has improved efficiency and output, further enhancing Sikama's competitive advantage in the semiconductor industry.

Again, customer satisfaction:

Sikama meets the strict requirements of customers by ensuring that the welding process is carried out in an oxygen free environment. The improved solder joint quality has increased customer satisfaction and strengthened Sikama's reputation as a trusted and reliable partner in the semiconductor industry. The customer's confidence in Sikama's solution has been further enhanced, thereby increasing customer loyalty and potential for future cooperation.

Improving solder joint quality to assist semiconductors:Industrial physics provides you with reliable solutions

Through collaboration and integration with Systech Illinois EC913 oxygen analyzer under Industrial Physics, Sikama International has achieved significant results and advantages in optimizing inert furnaces. The improvement of solder joint quality, reduction of scrap and rework, and increase in customer satisfaction have all contributed to Sikama's overall success and reputation in the semiconductor industry. By prioritizing the accuracy and reliability of heat treatment equipment, Sikama is able to continue providing innovative solutions to meet the constantly changing demands of the semiconductor market.

And industrial physics will also strive to provide more precise and highly adaptable online oxygen analysis applications, helping you in the semiconductor industry find solutions that meet your testing needs