In the field of semiconductor laser chip manufacturing, the temperature control accuracy of each process directly determines the performance and reliability of the product. Jiangxi Derui Optoelectronic Technology Co., Ltd., as a high-tech enterprise specializing in the semiconductor laser chip industry, has strict requirements for the stability and efficiency of its thermal processing equipment in the production of core chips such as VCSEL/EEL under IDM mode. For this purpose, Derui Optoelectronics has specially selected the AP-2CX-216A non-standard double-layer precision oven customized by Guangdong Aipei Testing Equipment Co., Ltd. to strengthen the quality defense line of chip manufacturing with precise temperature control technology.

Derui Optoelectronics, which has been deeply involved in the semiconductor "light" field for more than ten years, has products that serve more than 330 domestic and foreign customers in communication, optoelectronic sensing, consumer electronics, and other fields. It has standards for processes such as moisture removal and thermal curing in chip production. Any temperature fluctuations in the epitaxial growth and packaging process of semiconductor laser chips may lead to performance degradation, "said the production manager of Derui Optoelectronics. The shortcomings of traditional equipment in terms of volume adaptability and heating efficiency have made it difficult to meet the needs of large-scale production. Aipei Technology has become the preferred partner for equipment upgrades due to its technological accumulation and customization capabilities in the field of environmental testing equipment.

In response to the production pain points of Derui Optoelectronics, Aipei Technology has tailored the AP-2CX-216A non-standard double-layer precision oven to achieve precise matching of volume and performance. The equipment adopts a double-layer independent working chamber design, with a single chamber volume of 216L and a symmetrical structure with internal dimensions of 60 × 60 × 1500px (width × height × depth). It can simultaneously process multiple batches of chip substrates or packaged components, doubling processing efficiency in limited workshop space. This double-layer design not only meets the parallel production needs of Derui Optoelectronics' multi specification chips, but also avoids mutual interference between different processes through an independent temperature control system, adapting to its diversified product line.

In terms of core performance, the device demonstrates precision and efficiency comparable to imported devices. Its temperature range covers RT+15 ℃~150 ℃, which perfectly matches the temperature requirements of key processes such as semiconductor chip drying, pre firing, and epoxy resin packaging curing. Of particular note is that the equipment only takes about 10 minutes to heat up from room temperature (RT+10 ℃) to 100 ℃, which is more than 40% shorter than the industry average and significantly improves the production cycle of chip thermal processing. This performance advantage is due to the forced air circulation system and high-quality electric heating element configuration of Aipei Technology, combined with international first-line components such as Omron controllers from Japan, ensuring temperature stability and uniform distribution, and guaranteeing the performance consistency of the chip from the source.

Aipei's non-standard customized solution not only solves our production capacity bottleneck, but also significantly improves process stability. According to feedback from Derui Optoelectronics, after the equipment was put into use, the solder joint void rate in the chip packaging process decreased by 30%, and the product reliability test pass rate increased to 99.5%. At the same time, the one-stop support provided by Aipei Technology from solution design to after-sales service, as well as the high cost-effectiveness advantage of "imported quality, domestic price", further reduces the production and operation costs of enterprises.

This cooperation is not only another practice of Aipei Technology's non-standard customization capabilities, but also provides a reference model for the equipment upgrade of semiconductor laser chip manufacturing enterprises. In the future, Aipei Technology will continue to respond to manufacturing needs with technological innovation, while Derui Optoelectronics will also rely on precise and reliable equipment support to consolidate its industry position in the field of red light chips, injecting stronger "chip" power into the global optical application market.